Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,
for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

The present invention provides an adhesive composition for stereolithographic articles and non-stereolithographic articles, possessing excellent adhesive properties to both objects fabricated by stereolithography and molded articles made by methods other than stereolithography. The present invention relates to an adhesive composition for stereolithographic articles and non-stereolithographic articles, comprising: a polyfunctional (meth)acrylic polymerizable monomer (A); and an organic solvent (B) having a normal boiling point of 120 C. or less, and a viscosity at 25 C. of 10 mPa.Math.s or less, wherein the polyfunctional (meth)acrylic polymerizable monomer (A) comprises two or more polymerizable groups per molecule, and at least one selected from the group consisting of a urethane bond, an aromatic skeleton, and an amide bond, and the polymerizable groups of the polyfunctional (meth)acrylic polymerizable monomer (A) are (meth)acryloxy groups or (meth)acrylamide groups.

The present invention provides an adhesive composition for stereolithographic articles and non-stereolithographic articles, possessing excellent adhesive properties to both objects fabricated by stereolithography and molded articles made by methods other than stereolithography. The present invention relates to an adhesive composition for stereolithographic articles and non-stereolithographic articles, comprising: a polyfunctional (meth)acrylic polymerizable monomer (A); and an organic solvent (B) having a normal boiling point of 120 C. or less, and a viscosity at 25 C. of 10 mPa.Math.s or less, wherein the polyfunctional (meth)acrylic polymerizable monomer (A) comprises two or more polymerizable groups per molecule, and at least one selected from the group consisting of a urethane bond, an aromatic skeleton, and an amide bond, and the polymerizable groups of the polyfunctional (meth)acrylic polymerizable monomer (A) are (meth)acryloxy groups or (meth)acrylamide groups.