Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.

Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.

The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120 C. or more.

The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120 C. or more.

Metal or metallized reinforcer, at least the surface of which is at least partially metallic, at least said metallic part being coated with a polybenzoxazine, the repeat units of which comprise at least one unit corresponding to the formulae (I) or (II):

##STR00001##

in which: Z.sub.1 represents an at least divalent, aliphatic, cycloaliphatic or aromatic bonding group comprising at least one carbon atom and optionally at least one heteroatom selected from O, S, N and P; X.sub.1 and X.sub.2, which are identical or different, represent O or S; Ar.sub.1 and Ar.sub.2, which are identical or different, represent a substituted or unsubstituted phenylene group; Z.sub.2 represents O or (S).sub.n, the symbol n representing an integer equal to 1 or greater than 1.

Use of such a reinforcement for the reinforcement of a rubber article, in particular a motor vehicle tyre.

There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

An adhesive and method for injection or compression bonding, where the adhesive is based on a grafted polypropylene resin and at least one of maleimide compound, phenolic resin, blocked isocyanate, functionalized silane, or an epoxy resin.

A metal or metallized reinforcer, at least the surface of which is at least partially metallic, comprises at least a metallic part coated with a polybenzoxazine, the repeat units of which comprise at least one unit corresponding to the formulae (I) or (II):

##STR00001##

in which Z.sub.1 and Z.sub.2, which are identical or different, represent an at least divalent, aliphatic, cycloaliphatic or aromatic bonding group comprising at least one carbon atom and optionally at least one heteroatom selected from O, S, N and P. Such a reinforcement can be used for the reinforcement of a rubber article, in particular a motor vehicle tire.

A sulfurized benzoxazine compound, which is usable for the synthesis of a polybenzoxazin, corresponds to formula (A):

##STR00001##

in which: each benzene nucleus of the two oxazine rings bears at least one radical denoted as G; the two oxazine rings are connected together via a central aromatic group, the benzene ring of which bears one, two, three or four groups of formula S.sub.xR in which x is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon-based group including 1 to 10 carbon atoms and optionally a heteroatom chosen from O, S, N and P; and the at least two radicals G, which may be identical or different, are chosen from various groups