A dual curable thiol-ene composition comprising a polythiol, an unsaturated compound, a photoinitiator, an organic hydroperoxide (thermal initiator) and optionally a nitrogen-containing base, such as e.g. an N-heterocyclic compound (together with the organic hydroperoxide a redox initiator system). A cross-linked polymer prepared therefrom. A method of making such a polymer. A cured sealant comprising such a polymer. The sealant is preferably for use in aerospace.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

Chemically resistant sealant compositions include high equivalent weight sulfur-containing prepolymers. Upon exposure to chemicals the properties of sealants prepared using the prepolymers exhibit excellent fuel and phosphate ester resistance.

Dual cure compositions include a combination of an organoborane complex and a radical oxidizing agent as co-catalysts. The compositions are curable under dark conditions and can be used to catalyze thiol-ene reactions. The compositions are useful as sealants.

The present invention relates to a method of preparing a polyphenylene sulfide and a high-viscosity polyphenylene sulfide prepared using the method. In this method, the ratio of an organic phase to an aqueous phase is controlled by controlling dehydration conditions, so that high viscosity may be realized without adversely affecting a reaction or physical properties during preparation of the polyphenylene sulfide.

Provided are sealant compositions that include a first component and second component. The first component contains a polysulfide, a polythioether, or a copolymer or combination thereof containing pendant or terminal thiol groups, while the second in component contains an ethylenically-unsaturated compound and either the first or second component further contains a photoinitiator. Alternatively, the second component can contain a polyepoxide and either the first or second component can contain a photolatent base and a photosensitizer. The first or second component further contains a colorant that substantially reflects or substantially transmits light over the wavelength range from 350 nm to 500 nm. These compositions can provide cure-on-demand sealant formulations that comply with Class B sealant regulations on color, provide an acceptable depth of cure, and allow two-part mixing to be easily distinguishable.

Provided are sealant compositions that include a first component and second component. The first component contains a polysulfide, a polythioether, or a copolymer or combination thereof containing pendant or terminal thiol groups, while the second in component contains an ethylenically-unsaturated compound and either the first or second component further contains a photoinitiator. Alternatively, the second component can contain a polyepoxide and either the first or second component can contain a photolatent base and a photosensitizer. The first or second component further contains a colorant that substantially reflects or substantially transmits light over the wavelength range from 350 nm to 500 nm. These compositions can provide cure-on-demand sealant formulations that comply with Class B sealant regulations on color, provide an acceptable depth of cure, and allow two-part mixing to be easily distinguishable.

Disclosed are methods for making a cured sealant. The methods include depositing an uncured sealant composition on a substrate and exposing the uncured sealant composition to actinic radiation to provide a cured sealant. The uncured sealant composition includes a thiol-terminated polythioether, a polyene comprising a polyvinyl ether and/or a polyallyl compound, and a hydroxy-functional vinyl ether. Related sealant compositions are also disclosed.

Disclosed are methods for making a cured sealant. The methods include depositing an uncured sealant composition on a substrate and exposing the uncured sealant composition to actinic radiation to provide a cured sealant. The uncured sealant composition includes a thiol-terminated polythioether, a polyene comprising a polyvinyl ether and/or a polyallyl compound, and a hydroxy-functional vinyl ether. Related sealant compositions are also disclosed.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.