A dynamic cross-linked polymer nanocomposite adhesive has been developed by the oxidation of a thiol functionalized semi-crystalline and/or amorphous oligomer and thiol functionalized Cellulose Nanocrystals (CNCs) to form a polydisulfide network. The resulting solid material has a melting point transition at ca. 75 C. which corresponds to the melting of the semi-crystalline and/or amorphous phase of the nanocomposite adhesive. At higher temperatures (ca. 150 C.), results in the dynamic behavior of the disulfide bond being induced, where the bonds break and reform. Two levels of adhesion are obtained, in some embodiment by (1) heating the adhesive material to 80 C. (melting the semi-crystalline and/or amorphous phase) resulting in a lower modulus/viscosity of the adhesive, thus allowing better surface wetting on a substrate and (2) heating the adhesive material to 150 C. (inducing dynamic behavior of disulfide bonds), further lowers the modulus/viscosity of the adhesive ensuring a much better surface wetting and stronger adhesive bond. The polymer adhesive has been demonstrated to bind to, relatively high surface energy substrates including metal and hydrophilic glass, and to low surface energy substrates such as hydrophobic glass.

A dynamic cross-linked polymer nanocomposite adhesive has been developed by the oxidation of a thiol functionalized semi-crystalline and/or amorphous oligomer and thiol functionalized Cellulose Nanocrystals (CNCs) to form a polydisulfide network. The resulting solid material has a melting point transition at ca. 75 C. which corresponds to the melting of the semi-crystalline and/or amorphous phase of the nanocomposite adhesive. At higher temperatures (ca. 150 C.), results in the dynamic behavior of the disulfide bond being induced, where the bonds break and reform. Two levels of adhesion are obtained, in some embodiment by (1) heating the adhesive material to 80 C. (melting the semi-crystalline and/or amorphous phase) resulting in a lower modulus/viscosity of the adhesive, thus allowing better surface wetting on a substrate and (2) heating the adhesive material to 150 C. (inducing dynamic behavior of disulfide bonds), further lowers the modulus/viscosity of the adhesive ensuring a much better surface wetting and stronger adhesive bond. The polymer adhesive has been demonstrated to bind to, relatively high surface energy substrates including metal and hydrophilic glass, and to low surface energy substrates such as hydrophobic glass.

Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m.sup.3.

Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m.sup.3.

The present invention relates to catechol-derivative compounds of formula (I), as well as polymeric compounds obtained by condensation. The present invention also relates to the use of the compounds for preparing functional coatings and as adhesive substances.

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The present invention relates to catechol-derivative compounds of formula (I), as well as polymeric compounds obtained by condensation. The present invention also relates to the use of the compounds for preparing functional coatings and as adhesive substances.

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Provided is a sealing material for multi-layered glasses, including: a polysulfide resin (A) and a polyester resin (B) which is represented by Formula (1-1):

##STR00001##

or Formula (1-2):

##STR00002##

wherein A represents a dibasic acid residue, G represents a diol residue, X.sub.1 and X.sub.2 represent a hydrogen atom or a group represented by Formula (2-1):

##STR00003## wherein R represents an aromatic group or an aliphatic group, and X.sub.3 and X.sub.4 represent an aromatic group or an aliphatic group, n and m each represent the average number of repetitions of a repeating unit in parentheses and are each a numerical value larger than 0, and some or all A's are aromatic dibasic acid residues, and which has an aromatic dibasic acid residue content of 20 to 70% based on chemical formula weights calculated from the chemical formulae represented by [ ].sub.N and [ ].sub.M and also has a number average molecular weight of 400 to 5,000.

Provided is a sealing material for multi-layered glasses, including: a polysulfide resin (A) and a polyester resin (B) which is represented by Formula (1-1):

##STR00001##

or Formula (1-2):

##STR00002##

wherein A represents a dibasic acid residue, G represents a diol residue, X.sub.1 and X.sub.2 represent a hydrogen atom or a group represented by Formula (2-1):

##STR00003## wherein R represents an aromatic group or an aliphatic group, and X.sub.3 and X.sub.4 represent an aromatic group or an aliphatic group, n and m each represent the average number of repetitions of a repeating unit in parentheses and are each a numerical value larger than 0, and some or all A's are aromatic dibasic acid residues, and which has an aromatic dibasic acid residue content of 20 to 70% based on chemical formula weights calculated from the chemical formulae represented by [ ].sub.N and [ ].sub.M and also has a number average molecular weight of 400 to 5,000.

A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.

A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends without there being an optical fiber present in the ferrule bore.