A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.

A one-component curable organopolysiloxane composition that has excellent storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate pot life is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester, polyphenylene sulfide, and the like. Furthermore, the composition can be cured in a short period of time by increasing the temperature to a high temperature when rapid curing is required. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a photo-active hydrosilylation reaction catalyst; (D) a condensation reaction catalyst; (E) a curing inhibitor; and (F) an adhesion imparting agent having at least one terminal trialkoxysilyl group.

A one-component curable organopolysiloxane composition that has excellent storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate pot life is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester, polyphenylene sulfide, and the like. Furthermore, the composition can be cured in a short period of time by increasing the temperature to a high temperature when rapid curing is required. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a photo-active hydrosilylation reaction catalyst; (D) a condensation reaction catalyst; (E) a curing inhibitor; and (F) an adhesion imparting agent having at least one terminal trialkoxysilyl group.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ≤ 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.

The adhesive tape of the present disclosure includes: a substrate; and an adhesive layer disposed on one surface of the substrate. In the adhesive tape of the present disclosure, when a breakdown voltage in a thickness direction of the adhesive tape is represented as X (unit: kV) and an initial elastic modulus evaluated from a stress-strain curve in a tensile test is represented as Y (unit: N/mm), an inequality Y ≤ 4.5X -22.5 is satisfied. The adhesive tape of the present disclosure has an excellent balance between insulating properties and winding properties in winding work.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.