An objective is to provide a surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of −40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.

A method of inverting the phase arrangement of the silicone phase and the acrylic phase in a silicone acrylic hybrid composition, the silicone acrylic hybrid composition comprising: a) a silicone acrylic hybrid pressure sensitive adhesive, and b) a solvent, wherein the phase arrangement of the silicone phase and the acrylic phase in the initial silicone acrylic hybrid composition forming a continuous external phase and a discontinuous internal phase is determined by the solvent, comprising the step of adding an activator to the silicone acrylic hybrid composition, wherein the activator a) is liquid at 20° C. and 1013 mbar, b) has a boiling point which is higher than the boiling point of the solvent and/or has a vapor pressure at 20° C. which is lower than the vapor pressure of the solvent contained in the silicone acrylic hybrid composition, and c) provides better dissolution properties for the inner phase of the initial silicone acrylic hybrid composition than the solvent contained in the silicone acrylic hybrid composition.

A method of inverting the phase arrangement of the silicone phase and the acrylic phase in a silicone acrylic hybrid composition, the silicone acrylic hybrid composition comprising: a) a silicone acrylic hybrid pressure sensitive adhesive, and b) a solvent, wherein the phase arrangement of the silicone phase and the acrylic phase in the initial silicone acrylic hybrid composition forming a continuous external phase and a discontinuous internal phase is determined by the solvent, comprising the step of adding an activator to the silicone acrylic hybrid composition, wherein the activator a) is liquid at 20° C. and 1013 mbar, b) has a boiling point which is higher than the boiling point of the solvent and/or has a vapor pressure at 20° C. which is lower than the vapor pressure of the solvent contained in the silicone acrylic hybrid composition, and c) provides better dissolution properties for the inner phase of the initial silicone acrylic hybrid composition than the solvent contained in the silicone acrylic hybrid composition.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.