Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst.

The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

The present invention relates to an electrically conductive composition comprising a silicone resin comprising at least one vinyl-group; a silicone cross-linker having at least one Si—H group; electrically conductive particles; a solvent; an adhesion promoter; a catalyst; and an inhibitor, wherein ratio between Si—H groups and vinyl-groups is equal or greater than 1.3 but equal or less than 10.

The present invention relates to an electrically conductive composition comprising a silicone resin comprising at least one vinyl-group; a silicone cross-linker having at least one Si—H group; electrically conductive particles; a solvent; an adhesion promoter; a catalyst; and an inhibitor, wherein ratio between Si—H groups and vinyl-groups is equal or greater than 1.3 but equal or less than 10.

A composition contains a cluster organopolysiloxane having the following structure:

##STR00001##

where:

##STR00002##

and R is independently in each occurrence selected from a group consisting of aryl groups and alkyl groups having from 2 to 6 carbons; R′ and R″ are independently in each occurrence selected from divalent hydrocarbon groups containing from 2 to 6 carbon atoms; n is a value in a range of 50 to less than 200; and A is independently in each occurrence selected from a group consisting of acrylate, methacrylate and trialkoxysilyl groups; provided that, on average, 50 to 95 mole-percent of the A groups are selected from acrylate and methacrylate groups and 5 to 50 mole-percent of the A groups are selected from trialkoxysilyl groups.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

A curable silicone rubber composition of the type referred to in industry as “self-adhesive” or as having “selective adhesion” (hereafter referred to as “curable self-adhesive silicone rubber compositions”). The curable self-adhesive silicone rubber compositions comprise: (A) one or more organopolysiloxanes containing at least 2 alkenyl groups and/or alkynyl groups per molecule and having a viscosity in a range of 1000 mPa.Math.s to 200,000 mPa.Math.s at 25° C.; (B) an organopolysiloxane containing at least 2 or 3 silicon-bonded hydrogen atoms per molecule; (C) at least one hydrosilylation catalyst; (D) at least one reinforcing and optionally one or more non-reinforcing fillers; (E) an adhesion promoter; and (F) an oligomer which has been found to surprisingly provide heat-humidity stabilization.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.