Dual temperature curable silicone compositions, articles made from such compositions, and methods for the manufacture and use thereof. In particular, a dual temperature curable silicone composition is manufactured from a composition comprising a vinyl silicone; a silicone hydride-containing crosslinker; a platinum-containing catalyst; and a peroxide catalyst.

Dual temperature curable silicone compositions, articles made from such compositions, and methods for the manufacture and use thereof. In particular, a dual temperature curable silicone composition is manufactured from a composition comprising a vinyl silicone; a silicone hydride-containing crosslinker; a platinum-containing catalyst; and a peroxide catalyst.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A room temperature curable sealant/adhesive composition is disclosed. The room temperature curable sealant/adhesive composition comprises: (A) one or more organopolysiloxanes; (B) a hydrophilic material; (C) a cross-linker; (D) a titanate or zirconate catalyst; and (E) one or more optional ingredients. A silicone elastomer formed therefrom and related methods are also disclosed.

A room temperature curable sealant/adhesive composition is disclosed. The room temperature curable sealant/adhesive composition comprises: (A) one or more organopolysiloxanes; (B) a hydrophilic material; (C) a cross-linker; (D) a titanate or zirconate catalyst; and (E) one or more optional ingredients. A silicone elastomer formed therefrom and related methods are also disclosed.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.