A polypropylene-based adhesive containing a polypropylene-based resin (A′) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).

Described are compositions comprising a defoamer mixture comprising mineral oil and hydrophobic particles such as for example wax particles; di- or monoalkyl sulfosuccinate having at least 9 carbon atoms in the alkyl group and certain ethylene oxide/propylene oxide block copolymers. Also described are aqueous dispersions of hydrophobic polymers comprising these compositions and the use of the aqueous polymer dispersions as an adhesive, for example for producing composite films from transparent polymer films.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

Safety of products should be the most important aspect in any product available to the consumer. The following product of making an Easter Egg Paste to be placed on an eggshell to eliminate dye intrusion has been improved by reducing the need for edible salts in the formulation, and eliminating the need for emulsifiers such as soy lecithin and replacing them with more edible safe ingredients.

Safety of products should be the most important aspect in any product available to the consumer. The following product of making an Easter Egg Paste to be placed on an eggshell to eliminate dye intrusion has been improved by reducing the need for edible salts in the formulation, and eliminating the need for emulsifiers such as soy lecithin and replacing them with more edible safe ingredients.

Disclosed is a wax-based thermoplastic organic binder composition consisting of: 50 to 94 wt % of a wax mixture comprising paraffin wax and microcrystalline wax; 3 to 35 wt % of a polyolefin copolymer having a carbonyl group as a backbone polymer; and 3 to 15 wt % of a process control agent.

Disclosed is a wax-based thermoplastic organic binder composition consisting of: 50 to 94 wt % of a wax mixture comprising paraffin wax and microcrystalline wax; 3 to 35 wt % of a polyolefin copolymer having a carbonyl group as a backbone polymer; and 3 to 15 wt % of a process control agent.

Disclosed is a wax-based thermoplastic organic binder composition consisting of: 50 to 94 wt % of a wax mixture comprising paraffin wax and microcrystalline wax; 3 to 35 wt % of a polyolefin copolymer having a carbonyl group as a backbone polymer; and 3 to 15 wt % of a process control agent.