The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives.

The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives.

The invention provides hot melt adhesive with wide service temperature ranges, methods of using the adhesive to bond substrates together, to close/seal cases and cartons and the like, and to articles of manufacture comprising the adhesive. The hot melt adhesive comprises a metallocene catalyzed polyethylene copolymer, less than 10 wt % of a functionalized metallocene catalyzed polyethylene copolymer, greater than 22 wt % of a wax, a tackifier and optionally, additives.

A gel composition, a manufacturing method thereof, a tempered glass protective film and an electronic device are provided. The gel composition is processed by mixing a thermoplastic elastomer and oil, heating and stirring, using mixer to plastify and performing vacuum defoaming. The gel composition of the present disclosure is soft, and of which the hardness is smaller than 10 and the elastic modulus is about 1.2 Gpa. The gel composition can be completely filled in between the tempered glass and the electronic visual display after applying the tempered glass on the electronic visual display, so as to achieve the complete adherence without any air bubbles.

The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing and has excellent thermal stability, and further has excellent adhesion, in particular adhesion to a paper substrate. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) a butyral resin, (C) an olefin-based polymer, and (D) a tackifier resin.

Disclosed is a wax-based thermoplastic organic binder composition consisting of: 50 to 94 wt % of a wax mixture comprising paraffin wax and microcrystalline wax; 3 to 35 wt % of a polyolefin copolymer having a carbonyl group as a backbone polymer; and 3 to 15 wt % of a process control agent.

Disclosed is a wax-based thermoplastic organic binder composition consisting of: 50 to 94 wt % of a wax mixture comprising paraffin wax and microcrystalline wax; 3 to 35 wt % of a polyolefin copolymer having a carbonyl group as a backbone polymer; and 3 to 15 wt % of a process control agent.

The present invention provides pre-applied contact adhesives that maintains strong cohesiveness over extended time and varied temperature conditions, while balancing low adhesiveness to other substrates. The pre-applied adhesives are applied onto paperboard, corrugated board, Kraft paper, paper, plastic film, glass, and are suitable as label, package, envelope, carton, case, box, label, bag, multilayer film, foil bag, bottle or band.

A polypropylene-based adhesive containing a polypropylene-based resin (A) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (?H-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at ?10? C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10? C./min using a differential scanning calorimeter (DSC).

A polypropylene-based adhesive containing a polypropylene-based resin (A) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (?H-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at ?10? C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10? C./min using a differential scanning calorimeter (DSC).