C09J193/04

SILANE FUNCTIONALIZED ROSINS

Disclosed are silane functionalized rosins having multiple functionalities. Such silane functionalized rosins are curable and thus capable of providing unexpected properties for various uses and end products. Also disclosed are synthetic routes to prepare silane functionalized rosins, which are formulated with hydroxyl functional polymers to provide curable adhesive compositions. The adhesives may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

SILANE FUNCTIONALIZED ROSINS

Disclosed are silane functionalized rosins having multiple functionalities. Such silane functionalized rosins are curable and thus capable of providing unexpected properties for various uses and end products. Also disclosed are synthetic routes to prepare silane functionalized rosins, which are formulated with hydroxyl functional polymers to provide curable adhesive compositions. The adhesives may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE CONTAINING CURED PRODUCT THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

PRESSURE-SENSITIVE ADHESIVE SHEET FOR TOUCH PANEL, LAMINATE FOR TOUCH PANEL, AND CAPACITANCE-TYPE TOUCH PANEL
20170355173 · 2017-12-14 · ·

An object of the present invention is to provide a pressure-sensitive adhesive sheet for a touch panel which is excellent for the operability of a capacitance-type touch panel, which is able to suppress the occurrence of malfunctions in a capacitance-type touch panel in a wide range of temperature environments from low temperatures to high temperatures, and which is also excellent in pressure-sensitive adhesion. In addition, another object of the present invention is to provide a laminate for a touch panel and a capacitance-type touch panel which include a pressure-sensitive adhesive sheet for a touch panel. In the pressure-sensitive adhesive sheet for a touch panel of the present invention, a relative dielectric constant obtained by impedance measurement at 1 MHz at 20° C. is 4.0 or more, a temperature dependency obtained from a temperature dependency evaluation test is 25% or less, and a 180 degree peel strength with respect to glass is 0.2 to 1.2 N/mm.

Hot melt pressure-sensitive adhesive for labeling
09828535 · 2017-11-28 · ·

The present invention provides a hot melt pressure-sensitive adhesive being highly environmentally-friendly, as well having sufficient adhesion, thermal stability and coating performance, and also having an excellent hand-peeling property and alkali-peeling property. The present invention relates to a hot melt pressure-sensitive adhesive for labeling comprising: (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, and (C) a tackifier resin.

Hot melt pressure-sensitive adhesive for labeling
09828535 · 2017-11-28 · ·

The present invention provides a hot melt pressure-sensitive adhesive being highly environmentally-friendly, as well having sufficient adhesion, thermal stability and coating performance, and also having an excellent hand-peeling property and alkali-peeling property. The present invention relates to a hot melt pressure-sensitive adhesive for labeling comprising: (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, and (C) a tackifier resin.

Rubber-based adhesive composition and rubber-based adhesive using same

The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

Rubber-based adhesive composition and rubber-based adhesive using same

The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

A TACKIFIER AND A CONTINUOUS PROCESS FOR PRODUCING THE TACKIFIER

A rosin dispersion is a reaction product of, by dry weight based on total dry weight of the rosin dispersion, from 80% to 98% a rosin resin, and from 2% to 20% a dispersant. The rosin resin is processed by at least one method of a) modification, b) hydrogenation or disproportionation, and c) polymerization or esterification from raw material rosins. The dispersant is selected from C.sub.18-C.sub.32 aliphatic carboxylic acids, olefin (meth) acrylic acid copolymers, and other acid/anhydride modified polymers. A continuous process for preparing the rosin dispersion and an adhesive formulation comprising the rosin dispersion are also included.