Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa.Math.N).

An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.

The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

A method is provided for forming an adhered membrane roof system that meets Factory Mutual (FM) 4470/4474 standards for wind uplift. The method comprises applying a bond adhesive to a substrate on a roof to form an adhesive layer and applying a membrane directly to the adhesive layer. The bond adhesive includes a moisture-curable polymer.