The present application relates to an encapsulant for a PV module, a method of manufacturing the same and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep physical properties, and thus even when the encapsulant is used under conditions of a high temperature and/or high humidity for a long time, deformation is small and the encapsulant can exhibit excellent adhesive strength. Accordingly, when the encapsulant is applied to a PV module, durability or the like may be improved.

A hot melt adhesive film, and a preparation method, use, and an organosilicon polymer thereof are provided. The hot melt adhesive film includes: an inner layer, which is a polyolefin elastomer (POE); outer layers, which are an ethylene-vinyl acetate (EVA) copolymer on two surfaces of the inner layer; and intermediate layers, which are an organosilicon polymer between the inner layer and the outer layers. As intermediate layers, the organosilicon polymer plays the role of connection and transition, improves a bonding force between EVA and POE layers, and improves the stability of the hot melt adhesive film during long-term use. The hot melt adhesive film can be used as a packaging material for solar panels, touch screens, and the like.

A one or more component moisture cure Organosiloxane composition that has strength in an uncured state (commonly referred to in the industry as “green strength”) and its uses. The composition comprises an organopolysiloxane polymer having a viscosity of at least 1000 mPa.Math.s at 25° C. and not less than two silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups; a suitable catalyst; a cross-linker adapted to react with organopolysiloxane polymer when catalysed with the catalyst; and optionally one or more rheology modifiers and 0 to 10% by weight of the composition of one or more extenders or plasticisers but in particular the composition contains a precipitated calcium carbonate filler in an amount of from 50 to 70 weight % of the total composition.

An adhesive having water vapour barrier properties, comprising an adhesive base composed of at least one reactive resin, at least one elastomer and optionally at least one tackifying resin, and optionally a solvent, is particularly suitable as a barrier adhesive when it comprises at least one multifunctional oligomeric alkoxysiloxane, said oligomeric alkoxysiloxane containing more than one polymerizable group and more than one alkoxy group.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.

The invention provides a frameless photo-energy assembly including a photo-energy converter, wherein an edge of the photo-energy converter is sealed by an adhesive tape, comprising an adhering layer for adhesion and cushioning; and an aging-resistant protective layer. The adhering layer is used to contact the edge of an article and comprises: a substrate layer; optionally, a first adhesive layer and a second adhesive layer situated at both sides of the substrate layer oppositely, wherein the first adhesive layer being used to be contact with the article. The aging-resistant protective layer is situated on the adhering layer, which comprises: an optional primer layer, which is situated on the adhering layer; and a film layer, which is situated on either the primer layer or the substrate or the second adhesive layer. The invention further provides an adhesive tape for sealing an edge of an article and an article made of the assembly.

The invention provides a dual-initiated and fast cross-linked EVA (ethylene/vinyl acetate copolymer) film for the encapsulation of solar modules, which greatly enhances the speed of the encapsulation. The EVA film is mainly prepared from the following raw materials: 100 parts by mass of ethylene/vinyl acetate copolymer, 0.01 to 1.5 parts by mass of a free-radical photoinitiator, 0.01 to 1.5 parts by mass of a free-radical thermal initiator, 0.5 to 10 parts by mass of an auxiliary cross-linking agent, 0.1 to 5 parts by mass of a tackifier and 0.01 to 5 parts by mass of a light stabilizer. The present invention adds photothermal dual-initiated free-radical initiators and the auxiliary cross-linking agent of multi-functional acrylates or methacrylates to the EVA and use a thermal-UV dual curing process to prepare the solar module. The curing time is shorten to 5 to 10 min and the yield is high; meanwhile, the EVA film has advantages of uniform curing, high crosslink density, high bonding strength between the film and glass, and good anti-aging property.

Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.

The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerization; c) electrically conductive particles; and, d) inorganic particles selected from the group consisting of barium sulphate (BaSO.sub.4), magnesium hydroxide (Mg(OH).sub.2), aluminium hydroxide (Al(OH).sub.3), zinc oxide (ZnO), zinc hydroxide (Zn(OH).sub.2), titanium dioxide (TiO.sub.2), iron oxide and mixtures thereof.