Disclosed is a high-performance repair tape for a backboard of a photovoltaic module. The tape comprises a base material layer, a functional adhesive layer, and a release material layer provided in sequence from top to bottom; the base material layer is formed of a polyester thin film material; the functional adhesive layer is formed of a high weather-resistance adhesive. According to the high-performance repair tape for a backboard of a photovoltaic module, and a manufacturing method therefor provided by the present invention, by selecting a weather-resistant base material layer, effects, such as water resisting, insulation, and ultraviolet radiation resistance, can be achieved, and a backboard independence effect is achieved; by selecting a weather-resistant adhesive for the functional adhesive layer, the weather resistance, high temperature resistance, and yellowing resistance of the tape can be improved; the tape has a strong bonding strength and is not easy to peel off, and the tape is easy to fit and facilitates construction.

A copolymer that includes first divalent units having a pendent ultraviolet absorbing group, second divalent units represented by formula (I):, and third divalent units represented by formula (II):. Each R.sup.1 is independently hydrogen or methyl; R.sup.2 is a straight-chain or branched alkyl having from 1 to 20 carbon atoms; V is O or NH; W is alkylene having from 1 to 10 carbon atoms; and each R is independently alkyl having from 1 to 6 carbon atoms. Compositions including the copolymer, for example, pressure sensitive adhesive compositions are disclosed. Articles including the compositions are disclosed. For example, an assembly including a barrier film and the pressure sensitive adhesive composition is also disclosed. ##STR00001##

Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than 20 C., and a softening point (ring & ball) of greater than or equal to 70 C., and the PSA compound has being foamed.

A splicing adhesive film, a manufacturing method thereof, and a photovoltaic module are provided. The splicing adhesive film includes a first portion and a plurality of second portions. The first portion includes a first material, and each second portion includes a second material. The first portion is located in the central region, and the plurality of second portions each are at least partially located in the edge region. The first portion and each second portion are at least partially overlapped in the first direction. The maximum thickness of each second portion located in the edge region is P, and the maximum thickness of the first portion located in the central region is Q, P>Q.

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

Non-limiting embodiments of the present disclosure relate to a method comprising: obtaining asphalt shingle waste (ASW) and performing grinding, screening, and separating steps on the ASW. In some embodiments, granules are removed from the ASW. In some embodiments, the method transforms ASW into ASW powder. In some embodiments, the ASW powder is formed into a plurality of briquettes. In some embodiments, at least one of: the ASW powder, the plurality of briquettes, or any combination thereof is fed into a mixing process that results in an ASW powder filled coating. In some embodiments, the ASW powder is formed into an adhesive composition.

The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than 20 C., preferably greater than 0 C., and a softening point (ring & ball) of greater than or equal to 70 C., preferably greater than or equal to 100 C., and the pressure-sensitive adhesive compound being foamed.

Composite structures that include a first layer including a silicone block copolymer; a transition layer, the transition layer having a first surface contiguous with the first layer and a second opposing surface, the transition layer formed from the silicone block copolymer of the first layer; and a glass-like layer contiguous with the second surface of the transition layer, at least a portion of the glass-like layer formed from the transition layer.

An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.

A barrier adhesive comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one elastomer, optionally at least one adhesive resin, wherein the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, further comprising a transparent molecularly dispersed getter material and optionally a solvent, in which the getter material is at least one cyclic azasilane, has very long lag times and can be used over an area for encapsulation of organic electronic structures, since the sensitive structures are not damaged.