A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

Provided are a shoe component pretreatment solution and a pretreatment method using the solution, wherein the shoe component pretreatment solution comprises an acidic compound, a salt compound, an surfactant and water. The present invention involves applying the shoe component pretreatment solution to a rubber sole, thereby shortening the process of the pretreatment step, and avoids the use of any MEK organic solvents and also avoids the generation of suspended particulates caused by grinding, thus eliminating harm to the human body and the environment, and reducing the costs in terms of time and money.

A sole cleaning device for footwear includes a first panel and a second panel that is sized and shaped complementarily to the first panel. The first panel is sized so that the first panel is configured to substantially overlay a sole of an article of footwear. An adhesive is coupled to and substantially covers an upper surface of the first panel. The second panel is removably coupled to the adhesive so that the second panel is selectively detachable from the adhesive. The first panel is configured to overlay the sole of the article of footwear, positioning the adhesive to bind to debris that is adhering to the sole so that the debris is removed from the sole as the first panel is peeled from the sole.

Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.

Two part sole structures are provided having a first foam component containing a polyolefin resin with a polyurethane resin component adhered to a surface of the first foam component. For example, in some aspects, a sole structure or a portion thereof is provided having a first sole component containing a foam composition and a second sole component adhered to a surface of the first sole component, where the second sole component includes a polyurethane resin. The second sole component is in some aspects printed or extruded onto the surface of the foam. In particular, midsoles including the foams and having an outsole component on the ground facing portion are provided for use in an article of footwear. Methods of making the sole structures are provided, as well as methods of making an article of footwear including one of the sole structures.

A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.