The invention relates to an adhesive strip which can be detached substantially on the adhesion plane in a residue-free and nondestructive manner by stretching, said strip consisting of one or more adhesive material layers and optionally one or more intermediate carrier layers, at least one of the adhesive materials layers containing at least one filler, the primary particles of which can be individually separated, wherein the primary particles (i) are substantially spherical and (ii) have an average diameter d(0.5) of less than 10 ?m, and the ratio of the average diameter d(0.5) of the primary particles to the thickness of the adhesive material layer in which the primary particles are contained is less than 1:2. The invention also relates to the production and use of said adhesive strip.

The system may include a sheet of tape comprised of one-piece with a second side including an adhesive surface; a backing surface removably adhered to the second side of the sheet of tape; a first edge of the sheet of tape being a straight edge; the second edge being a length from a heel area to a toe area of a blade of a hockey stick; the second edge including a concave portion shaped similar to a curve of a top of the blade; the third edge being a length from the heel area to the toe area of the blade; the third edge including a concave portion shaped similar to the curve of the top of the blade; and the fourth edge including two convex portions shaped similar to a toe of the blade.

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

Layered constructions, such as those used in pressure sensitive adhesive constructions and release liner constructions, are disclosed having a functional layer that is capable of removal. Methods of utilizing the layered constructions are also disclosed.

Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.

The inventive perforated tape is a masking tape that has an elongate tape member further having a polymer coating top layer, a biodegradable paper mask layer middle layer, and a biodegradable polymer perforated lining member contiguously coupled to a bottom surface of the paper mask layer, a plurality of hole members parallelly disposed laterally and longitudinally substantially covering the entire polymer perforated lining member. The polymer perforated lining member further includes a plurality of solid portions of the polymer perforated lining member disposed laterally and longitudinally between the plurality of hole members adapted to resist tear so the elongate tape member tears substantially perpendicularly to longitudinal sides of the elongate tape member along a user-selected one row of a plurality of linear rows of hole members. An adhesive compound is disposed substantially on the entire bottom surface of the perforated lining member.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

An object of the present invention is to provide an adhesive film that can be applied easily to an adherend having a three-dimensional shape. An adhesive film according to the present disclosure is an adhesive film having a three-dimensional molded shape and including: a base layer; an adhesive layer including a fine structure in a surface; and a liner layer covering the adhesive layer. The fine structure of the adhesive layer includes a plurality of convex parts. Each of the plurality of convex parts includes two or more parts joined to each other via an interface. A first part present in a top of the convex part includes a non-adhesive or weak adhesive material, and a second part present below the first part includes a strong adhesive material.

A labeling system, comprising at least one label, wherein the at least one label is configured to receive printing thereon, and wherein the at least one label further comprises a release coating layer; a paper layer; a primer layer deposited on the paper layer; and an adhesive layer deposited over the primer layer, wherein a plurality of score lines have been cut into the at least one label at predetermined locations, to predetermined depths, and in predetermined patterns.

The present invention relates to a double-face adhesive tape that can be removed by twisting, prying or peeling off from, e.g., a wall without leaving residues. The present invention also relates to a method for the concealed mounting on and residue-free and non-destructive removal of objects from a sensitive substrate, wherein the object is affixed to the sensitive substrate by means of the double-face adhesive tape and, as and when necessary, is removed by twisting or prying or peeling.