Disclosed is a multi-layer screen protector for a display of an electronic device. The screen protector may include a glass exterior surface for tactile response, an optically clear anti-explosion adhesive to contain broken glass from the protector or the display, and a TPU layer to provide impact resistance. The screen protector may be flat or curved.

The present disclosure relates to adhesive article that include a stretch releasable adhesive and topographical, engineered elements on, within, or partially embedded in a surface of the adhesive. The engineered elements can act as spacers between the adhesive surface and the mounting surface to prevent full contact and wet out of the adhesive, whereby the article can be initially positioned or rotated by sliding the surface of the projections across the wall surface. Under certain conditions, the article may even be removed from the wall and placed at a new location without damage to the wall surface or the article. Once the location is selected, the separation created by the engineered elements can be overcome by applying sufficient pressure; the adhesive can contact and adhere more permanently to the wall. Thus, a stretch releasable adhesive articles of the present disclosure can move freely against the desired mounting surface, develop additional tack and holding power after sufficient pressure is applied.

ppA reusable adhesive device is shown and described. The reusable adhesive device includes a first material having a first adhesive located on a bottom side. An indicium which represents a food is located on the opposite side of the first material from the adhesive. The reusable adhesive device is capable of being placed on a dispenser. The dispenser will secure the reusable adhesive device to the dispenser. The dispenser will allow a length of material to he cut from the reusable adhesive device for use.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125 C. The base material layer has a first layer which contains a polyolefin having a melting point of 150 C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145 C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25 C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

Provided is an adhesive article which requires no separator and exhibits sufficient adhesive force without the need of any operation for adhesive-force development and in which the adhesive layer, even when in contact with itself, can be peeled off at the interface. The adhesive article includes an adhesive body including an adhesive layer, wherein the adhesive layer has a gel content of 5-70%, the adhesive article, through 7-day storage at 40 C., has a change in the gel content of the adhesive layer of 5% to 5%, and surface portions of the adhesive layer are in contact with each other.

The present invention relates to a pleated sealing tape for providing a waterproof covering. The pleated sealing tape includes a flexible sheet made of a polymeric material and having a plurality of pleats extending from a first end of the sheet to an opposing end of the sheet. The pleated sealing tape also has a front surface and a rear surface, and the rear surface of the sheet includes a pressure-sensitive adhesive. When the sheet is applied to a surface, the sheet is configured to be removed by stretching the sheet in a direction transverse to the orientation of the plurality of pleats and subsequently peeling the sheet off of the surface.

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

An adhesive film includes an adhesive film body, and a plurality of deformable particles dispersed in the adhesive film body. A volume of each of the plurality of deformable particles is capable of shrinking under a trigger condition.

Disclosed are photo-responsive pressure sensitive adhesives, wound dressings that contain the photo-responsive pressure sensitive adhesives, and methods to remove the wound dressing. The photo-responsive pressure sensitive adhesive comprises a viscoelastic polymeric matrix. The viscoelastic polymeric matrix comprises a polymer that includes at least a first polymeric segment and at least a second polymeric segment that are each covalently linked together through a photo-cleavable moiety. The photo-cleavable moiety is capable of photolytic cleavage of the covalent bonds formed between the moiety and the first and/or second polymeric segments, respectively, in response to electromagnetic radiation.

An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.