An adhesive composition having excellent adhesiveness to a cycloolefin resin or the like. The adhesive composition of the present invention includes a polymer having a repeating unit derived from a polymerizable compound represented by formula (I): Y—N(Ar)(R) Formula (I), in which Ar represents an unsubstituted or substituted C6 to C14 aryl group or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; R represents an unsubstituted or substituted C1 to C6 alkyl group, an unsubstituted or substituted C3 to C6 cycloalkyl group, an unsubstituted or substituted C6 to C14 aryl group, or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; and Y represents a polymerizable functional group. In Formula (I), a substituent on Ar and a substituent on R can bond to form a divalent organic group.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

A polypropylene-based adhesive containing a polypropylene-based resin (A′) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (ΔH-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at −10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).

A high-refractive adhesive film includes: a thermosetting resin matrix; and high refractive particles dispersed in the thermosetting resin matrix. The refraction index of the high-refractive particles is higher than that of the thermosetting resin matrix.

Composite materials and methods of producing the same are provided. In some embodiments, the composite materials can comprise a polymer substrate, an intermediary material, such as a metal or oxide, mechanically attached onto the polymer substrate, and an elastomer bonded to the polymer substrate on the side of the polymer substrate comprising the intermediary materials. The elastomer can be bonded to the polymer substrate irreversibly, where the elastomer and the polymer substrate cannot be separated at their interface without breaking either the elastomer or the polymer substrate. In some embodiments, a primer and/or an epoxy can also be used. Uses of material sputtering or sputtered materials are also provided to bond a parylene substrate and silicone elastomer, or to enhance the relative strength of the bonding between the two. In addition, composite materials, and the use thereof, involving a parylene substrate, an elastomer receptacle, and liquid silicone are provided.

Adhesion promoters, Curable compositions containing the adhesion promoters, cured compositions that are formed from the curable compositions, and articles containing the cured compositions are provided. The adhesion promoter has at least one epoxide group and a plurality of hydrolyzable silyl groups. The curable compositions include an adhesion promoter, an epoxy resin, and a curing agent for the epoxy resin that has at least two amino groups that are primary and/or secondary amino groups.

An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.

An adhesive tape for bonding low-energy surfaces, comprising a UV cross-linked pressure-sensitive adhesive compound which comprises poly-acrylate, a linear or branched vinyl aromatic block co-polymer and at least one adhesive resin. The UV cross-linking of the pressure-sensitive adhesive compound is the result of irradiation with UV-A-containing light.

Provided are curable precursor compositions for pressure-sensitive adhesives and related articles, assemblies and methods. The provided compositions contain an alkyl (meth)acrylate, a hollow non-porous particulate filler, and a surface-modifying agent comprising a hydrophobic alkoxy silane or hydrophobic organofunctional polysiloxane. These compositions and methods enable in situ functionalization of the filler particles during or after the time they are combined with the curable resin components, thereby allowing pressure-sensitive adhesive materials to be made faster and more efficiently than when using conventional manufacturing methods.