Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).

[In general formula (1), R.sup.1 is an alkyl group having 1-5 carbon atoms, and R.sup.2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]

Provided is a method of manufacturing self-adhesive polyurethanes using selective photo-polymerization. The method of manufacturing self-adhesive polyurethanes using photo-polymerization relates to a method for manufacturing photo-polymerized self-adhesive polyurethane substrates applicable to biocompatible epidermal soft sensors and attachable epidermal thermal heaters without particularly adding an adhesive additive.

Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two substrates. Structural adhesives including such adhesion promoters and methods for bonding two substrates are also disclosed herein.

The present invention relates to a pressure-sensitive adhesive composition including a base polymer and a material that is discolored by water or water vapor, a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing the pressure-sensitive adhesive composition, a method for producing the pressure-sensitive adhesive composition, and a method for attaching the pressure-sensitive adhesive sheet to an adherend and detecting presence of the water or the water vapor in the attached location.

The invention relates to polyvinal aromate-polydiene-block copolymer-based adhesive compounds that contain at least one type of a cationically curable reactive resin and that result, when cured, in improved thermal shear strength. The invention further relates to adhesive strips that contain at least one layer of such an adhesive compound, and a method of production.

The pressure-sensitive adhesive layer forming organopolysiloxane composition of this disclosure is hydrosilylation reaction curable, wherein 1 mass % or more of a resin component is (b2) an organopolysiloxane resin having a weight average molecular weight (Mw) as measured in terms of standard polystyrene by GPC using toluene that is less than 4000, and the value obtained by dividing Tg+120(? C.) of the pressure-sensitive adhesive layer obtained by curing by Tg+120(? C.) of the composition (pressure-sensitive adhesive layer), in which component (b2) is substituted by a resin with Mw 4000 or higher is less than 1.0. When used as a pressure-sensitive adhesive layer and when a specific resin component/polymer component ratio is selected to achieve a pressure-sensitive adhesive strength, the glass transition temperature (Tg) of the pressure-sensitive adhesive layer can be further reduced, resulting in a strong pressure-sensitive adhesive force and a low Tg at the same time.

An epoxy-based glue includes an epoxy material, and a solids component including diamond powder and silicon-carbide particles. The adhesive material may be used to form reaction-bonded silicon-carbide bonding reaction-bonded silicon-carbide parts together. The present disclosure also relates to a method of assembling a product from preforms, including locating an adhesive layer, containing diamond powder, between opposed preform surfaces, carbonizing the layer, and infiltrating molten silicon into the preforms and the carbonized layer to convert the preforms into corresponding reaction-bonded silicon-carbide parts, and to convert the carbonized layer into a reaction-bonded silicon-carbide bonding region with a reduced amount of residual silicon. An assembled product, including at least two reaction-bonded silicon-carbide parts bonded together by processing a diamond-containing adhesive, is also disclosed.

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acryloxyalkyl-functional group in a pendant position and a silicon bonded aliphatically unsaturated hydrocarbon group. An adhesive article, such as a tape, can be formed by coating the silicone hybrid pressure sensitive adhesive composition on a surface of a substrate and curing said composition via hydrosilylation reaction (B-staged cure) to form a silicone hybrid pressure sensitive adhesive layer on the surface. The silicone hybrid pressure sensitive adhesive layer contains (meth)acryloxyalkyl-functional groups, which can further react and crosslink via exposure to UV radiation (C-staged cure).

An adhesive material contains a styrene resin, a (meth)acrylate resin, and an oxidatively polymerizable compound, wherein the adhesive material has a sea-island structure that includes a sea portion containing the styrene resin and an island portion containing the (meth)acrylate resin, and the glass transition temperature of the (meth)acrylate resin is at least 30 C. lower than the glass transition temperature of the styrene resin.

Adhesive sheet material application squeegees are disclosed.