Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×10.sup.3 Pa.Math.s to 5×10.sup.6 Pa.Math.s.

The present invention provides: an adhesive composition for sealing an electronic device, the adhesive composition comprising an isobutylene-isoprene copolymer as a main component, the isobutylene-isoprene copolymer having a content of repeating units derived from isoprene of 0.1 to 99 mol % based on total repeating units; an adhesive sheet comprising a gas barrier film, and an adhesive layer that is formed on the gas barrier film, the gas barrier film having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 0.1 g/m.sup.2/day or less, and having a total light transmittance of 80% or more, and the adhesive layer comprising an adhesive composition that comprises an isobutylene-isoprene copolymer as a main component; and an electronic device or the like in which the adhesive composition and the adhesive sheet are used as a sealant for an organic electroluminescent element or the like. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and excellent adhesion; an adhesive sheet; and an electronic device or the like.

A display module includes substrate and adhesive portion. Substrate includes display portion, bending portion and bonding portion located on non-light-emitting side of display portion. Bending portion is located between display portion and bonding portion. Adhesive portion includes first adhesive portion including first adhesive sub-portion and second adhesive sub-portion located on side of first adhesive sub-portion facing away from bending portion. Bonding portion includes first bonding sub-portion at least partially overlapping first adhesive sub-portion in a first direction and second bonding sub-portion located on side of first bonding sub-portion facing away from bending portion at least partially overlapping second adhesive sub-portion in the first direction. In a first state, the distance between first bonding sub-portion and display portion is greater than the distance between second bonding sub-portion and display portion in first direction, thereby alleviating stress bonding portion withstands, and ensuring normal operation of display module in first state.

Disclosed is a composition for reactive hot melt resin and a reactive hot melt film prepared from the resin, which resin composition includes a polyurethane resin having a linear structure, an isocyanate blocking agent having a plurality of functional groups, a reaction catalyst, a reaction retardant, etc. Preferably, the resin composition includes a polyurethane resin and an isocyanate blocking agent used as a latent curing agent, which are main components; a catalyst for accelerating the reaction; and a reaction retardant for securing long-term storability. Particularly, the composition for reactive hot melt resin further includes a heat-resistance enhancer, preferably nanosilica, for preventing the resin from melting down during no-sew press treatment to provide a performance to help maintenance of adhesion.

A pressure-sensitive adhesive tape for molding a plastic lens having a substrate and a pressure-sensitive adhesive layer formed on a surface of the substrate. The pressure-sensitive adhesive layer includes an acrylic copolymer having a functional group and a crosslinking agent capable of reacting with the functional group; the acrylic copolymer has a weight-average molecular weight (M.sub.w) of 1,100,000 or more and a molecular-weight polydispersity (M.sub.w/M.sub.n) of 10.0 or less; the pressure-sensitive adhesive layer has an elution percentage of 48.0% or less when immersed for two hours in toluene the temperature of which being adjusted to 80° C.; the pressure-sensitive adhesive tape exhibits a shift length of 0.15 mm or more and 0.50 mm or less after 800 minutes in a creep test; and the plastic lens has a refractive index of 1.59 or more.

Provided is a curable silicone composition and uses thereof. The composition which has hot-melt properties, strongly adheres to poorly adhesive substrates, and is particularly superior in flexibility and toughness at high temperatures from room temperature to approximately 150° C. in cured products such as overmolding, in addition to providing a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A) organopolysiloxane resin microparticles where 20 mol % or more of all siloxane units is siloxane units represented by RSiO.sub.3/2 where R is a monovalent hydrocarbon group; (B) a silatrane derivative or a carbasilatrane derivative; (C) a curing agent; and (D) a functional inorganic filler. The content of component (D) is 50% or more by volume relative to the overall composition. The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

A surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate, the material of the first substrate at the first surface including at least two chemical species, one of which, called the species of interest, becomes depleted upon activation by ion or atom bombardment, the method including depositing a layer of the species of interest onto the first surface of the first substrate; activating the first surface by bombarding the first surface with an ion or atom beam so as to consume the entire previously deposited layer of species; and activating the second surface by bombarding the second surface with an ion or atom beam; and contacting the first surface of the first substrate with the second surface of the second substrate.

Provided are a chemical polymerization initiator including (a) a thiourea compound, (b) a peroxyester, (c) a divalent copper compound, and (d) an aryl borate compound, an adhesive composition, an adhesive composition kit, a dental material, and a dental material kit each using the chemical polymerization initiator, and a method of storing the adhesive composition.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

Imine, obtainable by reaction of (i) an amino-functionalised polyoxyalkylene, the polyoxyalkylene chains of which are a copolymer of oxyethylene and oxypropylene units, those polyoxyalkylene chains carrying primary amino groups (preferably two terminal primary amino groups per molecule), and (ii) a ketone and/or aldehyde having a hydrogen atom at the carbon atom in the alpha-position to the carbonyl carbon; and various subjects of the invention based thereon, especially in coating systems or adhesive systems.