Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.

A cooling tape and cooling pad. In a most general embodiment, the inventive tape includes a first layer of thermally conductive material; a second layer of thermal insulation; and a third layer of endothermic material, sandwiched between the first and second layers. The third layer is constructed with reactants effective to cause an endothermic chemical reaction. In a first embodiment, the invention provides a beverage cooling device. In a second embodiment, the invention provides a pipe cooling/freezing device. The cooling pad is implemented with a first layer of thermally conductive material; a second layer of material; and a third layer of endothermic material, sandwiched between the first and second layers. In the illustrative embodiment, the third layer has a contour effective to create suction whereby the pad adheres to a surface to be cooled.

Provided are a chemical polymerization initiator including (a) a thiourea compound, (b) a peroxyester, (c) a divalent copper compound, and (d) an aryl borate compound, an adhesive composition, an adhesive composition kit, a dental material, and a dental material kit each using the chemical polymerization initiator, and a method of storing the adhesive composition.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

A bonding method utilizing carbon nanotubes provides first and second objects to be bonded and a carbon nanotube structure. The carbon nanotube structure comprises a super-aligned carbon nanotube film comprising carbon nanotubes, the carbon nanotubes extending substantially along a same direction. The carbon nanotube structure is laid on surface of first object and surface of second object is pressed onto the carbon nanotube structure. Pressure being applied to the first object and the second object bonds the two together.

The present invention provides a method of manufacturing a high-strength carbon fiber resin tape and the high-strength carbon fiber resin tape that can be widely applied for reinforcement of PVC pipe, PP pipe, or the like. The high-strength carbon fiber resin tape according to the present invention comprises a base material including a binder, metal oxide sol, and potassium persulfate between acrylic carbon fibers; an adhesive material having one or more physical characteristics of heat resistance, cold resistance, or high-strength applied on one surface of the base material; and an ultraviolet protection coating applied on the other surface of the base material.

Provided is a barrier adhesive composition comprises polyisobutylene resin, organically modified nanoclay (e.g. mont-morillonite or bentonite) and sorbent nanoparticles (e.g. CaO which acts as a desiccant and/or getter). In a preferred embodiment, the barrier adhesive composition is disposed on a gas-barrier film to form an adhesive barrier film. The adhesive barrier film can then be used for protection from oxygen and moisture in OLED displays and solid state lightings, solar cells, electrophoretic and electrochromic displays thin film batteries, quantum dot devices, sensors (e.g. touch sensor) and other organic electronic devices. The adhesive barrier film is especially well-suited for applications that require oxygen and moisture protection as well flexibility and good optical transmittance.

A patch is provided and described that can be used with the installation of a cured-in-place structural liner in a conduit when the conduit has protrusions into the conduit. The patch is made with similar material to the liner, or felt, and is impregnated with epoxy. The patch may be shaped to more closely match the anticipated curve of the outer surface of the liner. Tools for the installation of the patches, a method of use, and tools for measuring the quality of the installation of the patch before the installation of the structural liner, are also described.

A preparation method for a phosphate-based high-temperature-resistant adhesive self-reinforced by in-situ growth and locking of flaky kyanite is provided, including: preparing a modified filler by using bauxite, kaolin, boric acid and boric oxide, and taking a reaction solution of diluted phosphoric acid and aluminum hydroxide powder as latex liquid, and mixing the modified filler, the latex liquid, and silicon powder to prepare the adhesive. After being treated at 700 C., kyanite grows within the adhesive. As the treatment temperature increases, the size and content of the kyanite are further increased, thereby forming a locking and reinforcing structure. After being treated at 1100 C., the bonding strength of the adhesive reaches up to about 50 MPa, and the adhesive illustrates excellent high-temperature-resistant bonding strength.

The invention utilizes swelling and fusion effects of graphene oxide in a solvent to implement cross-linked bonding of a graphene material itself and materials such as polymers, metal, paper, glass, carbon materials, and ceramics. The present invention not only overcomes the shortcoming in traditional adhesives of residual formaldehyde, but also has short drying time, high bonding strength and high corrosion resistance. The present invention is widely applied in the fields of aviation, aerospace, automobiles, machinery, construction, chemical, light industry, electronics, electrical appliances, and daily life, etc.