An optical assembly and a method for making the optical assembly. The optical assembly includes an optical element; an adhesion promoter; a blocking coating; a holder; and an adhesive configured to adhere the optical element to the holder. The blocking coating includes a light absorber that does not transmit light with wavelengths from greater than or equal to about 250 nm to less than or equal to about 400 nm; The light absorber is positioned such that light having a wavelength from greater than or equal to about 190 nm to less than or equal to about 500 nm is not incident to the adhesive. The adhesion promoter improves adhesion of the blocking coating to the optical element and reduces the likelihood of delamination during handling, operation, or clearing of the optical assembly.

A barrier film construction comprises an ultra-barrier film and a barrier adhesive. The adhesive layer comprises a barrier adhesive composition comprising a resin system and organically modified nanoclay; wherein the resin system comprises a first polyisobutylene resin having a viscosity average molecular weight of about 100,000 to about 1,200,000 g/mol and tackifier.

Described herein is an adhesive article for fire protection along with methods of using the same. The adhesive article comprises a substrate having a first major surface; an intumescent material fixedly attached to a central portion of the first major surface; and an adhesive layer disposed at least along two opposing distal portions of the first major surface.

Provided is a thermosetting resin composition that can satisfy both low transmission loss and radiation performance even under the same curing conditions as those for conventional substrate materials for high-frequency applications, and also provided are an adhesive sheet, a prepreg, and a laminate.

The thermosetting resin composition comprises a maleimide compound having at least two maleimide groups per molecule, a polyphenylene ether compound having at least two reactive organic groups per molecule, a curing accelerator, and an inorganic filler, wherein the inorganic filler is low-sodium aluminum oxide, and the low-sodium aluminum oxide has an Na.sup.+ ion content of 10 ppm or less.

A display module includes substrate and adhesive portion. Substrate includes display portion, bending portion and bonding portion located on non-light-emitting side of display portion. Bending portion is located between display portion and bonding portion. Adhesive portion includes first adhesive portion including first adhesive sub-portion and second adhesive sub-portion located on side of first adhesive sub-portion facing away from bending portion. Bonding portion includes first bonding sub-portion at least partially overlapping first adhesive sub-portion in a first direction and second bonding sub-portion located on side of first bonding sub-portion facing away from bending portion at least partially overlapping second adhesive sub-portion in the first direction. In a first state, the distance between first bonding sub-portion and display portion is greater than the distance between second bonding sub-portion and display portion in first direction, thereby alleviating stress bonding portion withstands, and ensuring normal operation of display module in first state.

Multilayer films and adhesive tapes that include such films, wherein the multilayer films include plasticized polyvinyl chloride and optionally one or more fillers.

Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.

A method of decoupling an adhesive system from a contact surface of an object is disclosed. The adhesive system has a full adhesive strength in a de-energized state. The adhesive system comprises a backing, carbon nanotubes, each having a first end region, coupled to the backing, and a second end region, opposite the first end region, and charged nanoparticles, each coupled to the second end region of at least one of the carbon nanotubes. The method comprises steps of electrically charging the backing and disengaging the adhesive system from the contact surface. Electrically charging the backing creates an electrical repulsion force between the backing and the charged nanoparticles, so that the full adhesive strength of the adhesive system is decreased to a reduced adhesive strength. Disengaging the adhesive system from the contact surface comprises applying a disengagement force to the adhesive system sufficient to overcome the reduced adhesive strength.

A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25 C. of from 10,000 to 1,000,000 mPa.Math.s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25 C. or having a viscosity at 25 C. of more than 1,000,000 mPa.Math.s; (C) an organopolysiloxane resin represented by the following average unit formula: (R.sup.1.sub.3SiO.sub.1/2).sub.x(SiO.sub.4/2).sub.1.0, wherein each R.sup.1 represents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

An optical assembly and a method for making the optical assembly. The optical assembly includes an optical element; a blocking coating; a capping layer on the blocking coating; a holder; and an adhesive configured to adhere the optical element to the holder. The blocking coating includes a light absorber that does not transmit light with wavelengths from greater than or equal to about 250 nm to less than or equal to about 400 nm; The light absorber is positioned such that light having a wavelength from greater than or equal to about 190 nm to less than or equal to about 500 nm is not incident to the adhesive. The capping layer is made from a material having high transmission in the UV and enables use of aggressive cleaning treatments on the optical element significant impairment of the UV transmission of the optical element.