An apparatus, comprising; a piece of material having a first end and a second end and a first side and second side, wherein the piece of material has a predetermined length and width of approximately, an adhesive member having a first side and a second side, wherein each side has adhesive properties, and the adhesive member is attached distal to the first end of the piece of material on the first side, a removable cover, detachably secured to the adhesive member exposed side, and at least one tie attached to the to the second end of the piece of material.

A self-crosslinkable polyurethane or polyurethane-urea aqueous dispersion, a preparation method therefor, and a use thereof. Side chains of the polyurethane or polyurethane-urea contain non-sterically-hindered siloxy groups. During the drying and activation of the aqueous dispersion, the siloxys in the side chains are hydrolyzed and crosslinked with each other to increase the cross-linking density, significantly improving the heat resistance, the humidity resistance, and other properties of an adhesive obtained therefrom. The aqueous dispersion itself has a good stability. In addition, an application system based thereon has an excellent stability and a long storage time. The aqueous dispersion is suitable for the preparation of high quality paints and sealants, especially adhesives.

Provided are adhesive compositions comprising copolymers having biomimetic cross-linkable monomers derived from mussel adhesive proteins. Also provided are methods of curing the adhesive compositions, methods of manufacturing the adhesive compositions, and devices comprising the adhesive compositions.

A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form a secure bond with the wallboard panels.

The invention relates to a film comprising an optionally multilayer carrier layer; wherein one surface side of the carrier layer has been modified over part of its area either by surface activation or by printing with a print medium, such that the surface side has modified regions and unmodified regions; wherein the modified regions and the unmodified regions are coated over part or all of the area by a release material; and wherein the strength of adhesion of the release material to the carrier layer in the modified regions is different compared to the adhesion of the release material to the carrier layer in the unmodified regions.

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body.

Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer 13b having tackiness and being laminated with the electroconductive joining layer. The tack layer 13b is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element 2 and the substrate 40 are joined.

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.

The present specification relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate.

A polymeric tape comprises a facestock extending lengthwise, the facestock including a polymer. An adhesive layer is on a first surface of the facestock. Tear-cuts are formed into at least one longitudinal edge of the facestock and extending inwardly, the tear-cuts being provided all along the at least one longitudinal edge of the facestock.

A ply-bonding agent or adhesive composition characterized by a viscosity and a surface tension for the manufacture of paper tissue and paper towel, includes: (a) water; (b) nanofibrillated cellulose; and (c) one or more modifiers effective to modify either or both of (i) the viscosity of the composition or (ii) the surface tension of the composition, wherein the one or more additional modifiers are selected from the group consisting of components (iii), (iv), (v), (vi), (vii) or (viii), wherein: (iii) is PVOH and a viscosity modifier; (iv) is a viscosity modifier; (v) is a viscosity modifier and a surface tension modifier other than PVOH; (vi) is a water-soluble cellulose derivative; (vii) is a water soluble polyol; and (viii) is a surface tension modifier other than PVOH. The compositions are particularly useful for ply-bonding multi-ply absorbent sheet when the plies are treated with debonder.