Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.

The problem to be solved by the present invention is to provide an adhesive multilayer sheet including an adhesive layer that includes an acid-modified polyolefin and a substrate layer that includes a polyphenylene ether, and having high interlayer peel strength. The multilayer sheet of the present invention includes: a substrate layer (A) that includes a polyphenylene ether; and an adhesive layer (B) that includes an acid-modified polyolefin, in which the multilayer sheet further includes, between the substrate layer (A) and the adhesive layer (B), a tie layer (C) that includes a polyolefin/polyphenylene ether-based alloy.

A multi-layer plastic film as a carrier film for a glue layer, comprising a layer sequence of (a) an outer layer (a) based on a mixture of ) 3-15 wt % of an extrudable glue and ) 85-97 wt % of at least one C.sub.2-C.sub.8 olefin-alkyl acrylate copolymer, C.sub.2-C.sub.8 olefin-methacrylic acid copolymer and/or C.sub.2-C.sub.8 alkyl methacrylate copolymer, wherein the mixture of ) and ) must be compatible with each other, (b) a layer (b) of at least one polyolefin or one olefin copolymer, (c) a layer (c) of at least one polyolefin or one olefin copolymer, and optionally typical auxiliary substances, as a second outer layer, and composites of said carrier film and an adhesive layer.

The invention relates to a method for welding a polyolefin plastic and a plastic consisting of a polymer with at least one aromatic unit in the polymer main chain, using a primer which contains at least one polymer built from at least one monomer with at least one double bond. The invention also relates to correspondingly welded products.

The invention relates to a method for welding a polyolefin plastic and a plastic based on at least one polymer containing carbonyl groups, using a primer which contains, in relation to the proportion of polymer in said primer, at least 20 wt. % of a polymer that comprises maleic anhydride or maleic anhydride derivative units. The invention also relates to correspondingly welded products.

The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.