The invention relates to an adhesive-coated polymer substrate comprising (a) a polymer substrate containing or consisting of a thermoplastic polymer with a Vicat A50 softening point according to DIN EN ISO 306 of up to 220° C., and (b) an adhesive composition coated directly on at least one side of the polymer substrate, wherein the adhesive composition (b) is a UV-curable or UV-cured hot melt pressure sensitive adhesive (PSA). The invention relates moreover to a process for the manufacture of the adhesive-coated polymer substrate as well as to the use thereof.

A pressure sensitive adhesive article is described comprising a pressure sensitive adhesive in contact with the release layer. The release layer comprises a thermoplastic polymer and a block copolymer additive having the general structure: A[LB]n wherein A is a polyorganosiloxane block, L is a covalent bond or a divalent linking group B is independently a C16-C70 alkyl group, and n is at least 1. In other embodiments, compositions are described comprising a thermoplastic polymer the described block copolymer additive; as well as methods of making a release composition.

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.

A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

A substrate 2 of an adhesive tape 1 includes a mesh structure made of thermoplastic resin. The mesh structure has a structure in which multiple first fibers drawn in a first direction corresponding to a length direction of the adhesive tape and multiple second fibers drawn in a second direction corresponding to a width direction of the adhesive tape are layered or woven. (a) A first fiber has a thickness of 0.04 mm or less, and a width of 0.6 mm or less, (b) a second fiber has a thickness greater than that of the first fiber, and a width greater than or equal to that of the first fiber, (c) the mesh structure has a tensile strength in the first direction of from 130 to 250 N/50 mm, (d) the mesh structure has a bending resistance in the first direction obtained by a cantilever test of from 40 to 80 mm, and (e) the mesh structure has a bending resistance in the second direction obtained by the cantilever test of from 65 to 95 mm.

A universal barrier system includes universal barrier components that may be assembled together to shield floors and walls from moisture and provide a thermal break in an operational area of the universal barrier component. A lap zone of the universal barrier component may allow universal barrier components to be assembled and installed to protect floors, walls, ceilings, footings and the like from moisture and heat gain or loss by minimizing the need for tapes and other joining methods. The universal barrier system may also act as a sound deadening material. The operational area and lap zone of the universal barrier component may be disposed on a vapor block layer to provide some rigidity. The operational area of the universal barrier component may include a thermal break disposed upon the vapor block layer. The thermal break may include an outer protective layer. In addition, universal barrier tape and universal barrier edging may be provided to couple adjoining universal barrier components.

The present disclosure provides a floor marking tape. The floor marking tape has a total thickness of less than 40 mil (1.016 mm). The floor marking tape includes (A) a top layer including a polymer having a flexural strength of greater than 2,100 psi (14.48 MPa) and (B) an adhesive layer including a pressure sensitive adhesive (PSA) in contact with the top layer.

A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.