A present invention related to a method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, including: melting adhesive resin made of any one selected from thermoplastic polyurethane (TPU) or ethylene vinyl acetate (EVA) containing hydrophobic nano-silica in the range of 0.2 to 5 phr and applying to the surface of the transfer roller in which the intaglio dot pattern is formed in a mesh shape in the shape of the shoe insole; removing the adhesive resin applied other area than the intaglio dot pattern of the surface of the transfer roller; transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of the foam or the fabric; bonding the foam and the fabric by compressing; and cutting a shoe insole shape in a package in which the foam and the fabric are bonded.

A masking film includes an adhesion layer that includes at least one hydrogenated styrene block copolymer and an adhesive surface having a surface roughness (Sa) of greater than about 2.0 μm. An Adhesion Build Value of the masking film is less than about 2.0 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 85° C. for 30 minutes.

A masking film includes an adhesion layer that includes at least one hydrogenated styrene block copolymer and an adhesive surface having a surface roughness (Sa) of greater than about 2.0 μm. An Adhesion Build Value of the masking film is less than about 2.0 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 85° C. for 30 minutes.

Embodiments of the present disclosure are directed to coextruded multilayer films comprising a comprising a plurality of layers, wherein at least one layer comprises the thermoplastic adhesive composition, the thermoplastic adhesive composition comprising: at least one maleic anhydride-grafted ethylene-based polymer; at least one at least one ethylene/α-olefin/non-conjugated diene interpolymer having a molecular weight distribution (MWD)≥2.5, wherein MWD=Mw/Mn, wherein Mw is weight averaged molecular weight and Mn is number averaged molecular weight, which are both determined by gel permeation chromatography; and a very low density polyethylene (VLDPE) having a density in the range 0.885 to 0.915 grams/cm.sup.3.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

The present disclosure provides adhesive articles that can be removed from surfaces without damage by having reduced or eliminated contribution of a core backing to peel force generated by the adhesive during removal. In some instances, this can be accomplished by a core that loses structural integrity in a direction normal to a plane defined by a major surface. In other instances, the contribution is reduced by compromising the interface between the core and a peelable adhesive layer.

An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

An adhesive formulation is provided that is a waterborne bonding adhesive for adhering sheet membranes that may incorporate a solid plasticizer. The formulation is fast-curing and develops bond strength rapidly after application to a substrate as the adhesive dries, when the sheet membrane is mated to the substrate. The fast-curing characteristic is important to ensure the membrane is not displaced from the surface in windy exterior applications. The adhesive is formulated to form the bond between sheet membranes to substrates that illustratively include, steel, wood, concrete, roof boards, insulation, and fiberglass mat roof boards.

An adhesive formulation is provided that is a waterborne bonding adhesive for adhering sheet membranes that may incorporate a solid plasticizer. The formulation is fast-curing and develops bond strength rapidly after application to a substrate as the adhesive dries, when the sheet membrane is mated to the substrate. The fast-curing characteristic is important to ensure the membrane is not displaced from the surface in windy exterior applications. The adhesive is formulated to form the bond between sheet membranes to substrates that illustratively include, steel, wood, concrete, roof boards, insulation, and fiberglass mat roof boards.

The invention features a moisture sensitive hot melt composition in individual forms, the individual forms including a core of moisture sensitive hot melt composition, and an outer shell comprising a thermoplastic polymer, wherein the individual forms include a sealed zone of the outer shell material, extending outward from the body of the individual forms, on at least two opposing sides of the individual forms.