The present disclosure provides adhesive articles that can be removed from surfaces without damage by having reduced or eliminated contribution of a core backing to peel force generated by the adhesive during removal. In some instances, this can be accomplished by a core that loses structural integrity in a direction normal to a plane defined by a major surface. In other instances, the contribution is reduced by compromising the interface between the core and a peelable adhesive layer.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not gloss or burnish a coating on a prefinished building article.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not gloss or burnish a coating on a prefinished building article.

The present disclosure, in one embodiment, relates to a system and method to transfer material to a substrate. In one embodiment, the system for material transfer includes an adhesive sheet and a transfer material sheet. The adhesive sheet comprises an adhesive, such as ethylene acrylic acid (EAA), ethylene methacrylic acid (EMAA), or ethylene-vinyl acetate (EVA), and a paper release backing. The paper release backing may comprise supercalendered kraft base paper. The transfer material sheet may include a transfer material and a material release liner. The transfer material may be metallized polyester

The present disclosure, in one embodiment, relates to a system and method to transfer material to a substrate. In one embodiment, the system for material transfer includes an adhesive sheet and a transfer material sheet. The adhesive sheet comprises an adhesive, such as ethylene acrylic acid (EAA), ethylene methacrylic acid (EMAA), or ethylene-vinyl acetate (EVA), and a paper release backing. The paper release backing may comprise supercalendered kraft base paper. The transfer material sheet may include a transfer material and a material release liner. The transfer material may be metallized polyester

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Floor coverings having a greige good, an adhesive layer, and a secondary backing material. The greige good has a primary backing component having adjoined first and second portions, and a plurality of fibers. The secondary backing material has an attached portion and a first exposable portion, with the attached portion adhered to the first portion of the primary backing component by contact with the adhesive layer. The second portion of the primary backing component is unattached to the first exposable portion of the secondary backing material, and the first exposable portion defines a portion of the first end edge of the floor covering. The second portion of the primary backing component is selectively moveable relative to the first portion to a position in which at least a portion of the second portion of the primary backing component does not overlie the first exposable portion of the secondary backing material.

Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an ,-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

A surface protection film includes an adhesion layer that includes a blend of a first hydrogenated styrene block copolymer, a second hydrogenated styrene block copolymer different from the first hydrogenated styrene block copolymer, and polyethylene. An Adhesion Build Value of the surface protection film is less than 2.5 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 90 C. for 10 minutes.

A surface protection film includes an adhesion layer that includes a blend of a first hydrogenated styrene block copolymer, a second hydrogenated styrene block copolymer different from the first hydrogenated styrene block copolymer, and polyethylene. An Adhesion Build Value of the surface protection film is less than 2.5 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 90 C. for 10 minutes.