C09J2423/04

Simplified stacked pallet and method of making the same

The inventors have discovered that certain hot melt adhesives can be used to form a stable stacked pallet that can limit the need for additional packaging materials e.g. inter-layer and pallet wrap.

MULTI-LAYER FILM

It relates to a multi-layer film for seal-peel applications, an article comprising said film and the use of said film.

MULTI-LAYER FILM

It relates to a multi-layer film for seal-peel applications, an article comprising said film and the use of said film.

WATER-BASED PRESSURE SENSITIVE ADHESIVE COMPOSITIONS AND METHODS OF MAKING SAME

Water-based pressure sensitive adhesive compositions are disclosed comprising (a) an acrylic emulsion having a glass transition temperature of less than or equal to 20 C., (b) optionally, a dispersant or a silane-containing compound, and (c) an ethylene or propylene copolymer emulsion. In some embodiments, (a) comprises from 75 to 99 wt % of the compositions, (b), when present, comprises from 0.1 to 5 wt % of the compositions, and (c) comprises from 0.1 to 25 wt % of the composition, each based on the dry weight of the compositions. Methods for preparing water-based pressure sensitive adhesive compositions are also disclosed comprising emulsion polymerizing at least one unsaturated monomer, thereby forming an emulsion polymer having a glass transition temperature of less than or equal to 10 C. and blending the emulsion polymer together with a dispersant or silane-containing compound and an ethylene or propylene copolymer emulsion. Water-based pressure sensitive adhesives and pressure sensitive adhesive films are also disclosed.

Low application temperature hot melt adhesive composition and a method including the same

The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107 C., while maintaining excellent bonding under stress and a very fast setting time.

USE OF A PARTICULAR ETHYLENE-BUTYL ACRYLATE COPOLYMER IN A HOT-MELT ADHESIVE COMPOSITION THAT IS TRANSPARENT IN THE MOLTEN STATE

The present invention relates to the use of at least one ethylene and butyl acrylate copolymer, as defined below, as a cohesion agent, in a hot-melt adhesive composition.

The invention also relates to a hot-melt adhesive composition comprising at least one adhesive hydrocarbon resin, preferably hydrogenated, and at least one ethylene and acrylate copolymer as defined below.

The invention also relates to the use of the corresponding hot-melt adhesive composition for the production of a manufactured article.

Sealing material for solar cell modules, and manufacturing method thereof

Disclosed are a sealing material for solar cell modules and a manufacturing method thereof capable of endowing good transparency and heat resistance to the sealing material for solar cell modules while using a polyethylene-based resin. The disclosed sealing material for solar cell modules uses a polyethylene-based resin with a density of 0.900 g/cm3 or less, and an MFR between 0.1 g/10 min and 1.0 g/10 min. The sealing material is obtained by melt molding a resin composition containing a polyethylene-based resin with density 0.890 g/cm3 or less, and a polymerization initiator contained at 0.02 mass % or more but less than 0.5 mass % of the composition, wherein the density difference of the resin composition before and after the melt molding is within 0.05 g/cm3, and the MFR difference of the resin composition before and after the melt molding is 1.0 g/10 min or greater.

ADHESIVE FILM AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

LASER DICING ASSISTANCE SHEET
20200040225 · 2020-02-06 ·

Provided is a laser dicing assistance sheet with which chips can be prevented from coming loose during full-cut dicing by laser light irradiation can be prevented. The laser dicing assistance sheet comprises an adhesive layer formed from an adhesive composition. The adhesive layer is characterized by being adjusted such that the residual weight (as measured under a flow of nitrogen (50 ml/min) at a heating rate of 10 C./min) of the constituent material (adhesive composition) at 500 C. is not more than 5.5%.

IMPROVED ADHESIVE POLYMER COMPOSITION

An adhesive polymer composition comprising a non-elastomeric copolymer of ethylene and one or more comonomers having 3 to 10 carbon atoms, and an elastomer is disclosed herein. The non-elastomeric copolymer is present in an amount of 60 to 95% by weight, based on the adhesive polymer composition, has a weight average molecular weight Mw of from 50 000 to 80 000 g/mol, molecular weight distribution Mw/Mn of 2.0 to 5.5, density of from 0.925 to 0.945 g/cm.sup.3, and at most 0.1 vinyl groups/1000 carbon atoms. The non-elastomeric copolymer or the non-elastomeric copolymer and the elastomer have been grafted with an acid rafting agent.