A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 μm and 150 μm. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 μm and 150 μm. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa.Math.s or more and 300,000 mPa.Math.s or less measured at 18° C. using a Brookfield viscometer.

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa.Math.s or more and 300,000 mPa.Math.s or less measured at 18° C. using a Brookfield viscometer.

The present invention is directed to hot-fill/retort packaging films having a sealant layer composition comprising a first propylene-ethylene copolymer, a second propylene-ethylene copolymer and a polyethylene. Hot-fill/retort packaging films are provided herein having a sealant layer composition that exhibits an ultimate hot tack within a range from 88 N/m to 876 H/m (0.5 lb./in to 5 lb./in) at a temperature within the range from 116° C. to 182° C. (240° F. to 360° F.).

The present invention is directed to hot-fill/retort packaging films having a sealant layer composition comprising a first propylene-ethylene copolymer, a second propylene-ethylene copolymer and a polyethylene. Hot-fill/retort packaging films are provided herein having a sealant layer composition that exhibits an ultimate hot tack within a range from 88 N/m to 876 H/m (0.5 lb./in to 5 lb./in) at a temperature within the range from 116° C. to 182° C. (240° F. to 360° F.).

The present invention relates to an adhesive polyethylene composition comprising (A) from 60 to 90 wt % of a non-elastomeric polyethylene being a terpolymer of ethylene with two different alpha-olefin comonomer units selected from alpha-olefins having from 4 to 12 carbon atoms; (B) from 9.0 to 38 wt % of an elastomer; wherein onto component (A) or components (A) and (B) an acid grafting agent (C) has been grafted in an amount of from 0.01 to 3.0 wt %, all based on the total weight of the adhesive polyethylene composition, a multi-layer structure comprising said adhesive polyethylene composition and the use of said adhesive polyethylene composition for the production of a multi-layer structure.

An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.

A pressure sensitive adhesive composition that includes: a (meth)acrylic ester polymer (A) containing, as a monomer unit constituting the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below; and an ionic compound (B).

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A pressure sensitive adhesive composition that includes: a (meth)acrylic ester polymer (A) containing, as a monomer unit constituting the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below; and an ionic compound (B).

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