Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an ,-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

Resin composition comprises 35 to 59.9 parts by mass of a propylene polymer (A) satisfying below; 25 to 40 parts by mass of a soft propylene copolymer (B); 0.1 to 10 parts by mass of a polyolefin (C) containing a structural unit derived from an unsaturated carboxylic acid and/or a derivative thereof; and 15 to 30 parts by mass of an ethylene polymer (D) (provided that the total of (A), (B), (C), and (D) is 100 parts by mass), wherein an MFR measured at 230 C. and a load of 2.16 kg according to ASTM D-1238 is 7 g/10 min or more and 25 g/10 min or less, with each component satisfying certain requirements.

Resin composition comprises 35 to 59.9 parts by mass of a propylene polymer (A) satisfying below; 25 to 40 parts by mass of a soft propylene copolymer (B); 0.1 to 10 parts by mass of a polyolefin (C) containing a structural unit derived from an unsaturated carboxylic acid and/or a derivative thereof; and 15 to 30 parts by mass of an ethylene polymer (D) (provided that the total of (A), (B), (C), and (D) is 100 parts by mass), wherein an MFR measured at 230 C. and a load of 2.16 kg according to ASTM D-1238 is 7 g/10 min or more and 25 g/10 min or less, with each component satisfying certain requirements.

A method comprising providing a polymeric substrate having a melting point of from about 130 C. to about 190 C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100 C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150 C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120 C.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

A degradable EVOH high-barrier composite film, characterized in that the materials of various layers in the composite film all obtain approximately-consistent biodegradability by introducing biomass, and the additive amount of the additive master batch in the materials of each layer is controlled within the range of 0.3-15% of the total mass of the materials of the corresponding layer; the hydrophilic activity of the hydrophilic groups in the additive master batch should be greater than or equal to that of the hydrophilic groups in the materials of each layer; by adding the additive master batch, the mole ratios of the hydrophilic groups to carbon atoms of the materials of various layers tend to be consistent, namely, the bioactivities tend to be consistent, so that the degradation rates of the materials of various layers in the composite film tend to be consistent. The present invention makes contribution to obtaining approximately-consistent bioactivities and approximately-consistent biodegradation rates by balancing the mole ratios of the hydrophilic groups to carbon atoms in the materials of various layers, and the appearance, the functions and the physical and mechanical properties of a product remain unchanged.

Provided is an adhesive composition, including a modified polypropylene-based resin (A) that contains at least one of an acidic group or an acid anhydride group, and that contains a (meth)acryloyl group (a), in which the (meth)acryloyl group (a) is introduced by a modification reaction of at least one of an acidic group or an acid anhydride group of a polypropylene-based resin (h) that contains the at least one of the acidic group or the acid anhydride group.

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1VB 1)/VA1}100 (Formula 2): Vx2=1(VA2VB2)/VA2100

A water-activated tape including: a laminate that includes a paper layer and a polymeric reinforcement film layer bonded to the paper layer; a primer coating disposed on the polymeric reinforcement film layer of the laminate; and a water-activatable adhesive layer disposed on the primer-coated surface of the polymeric reinforcement film.