Patent classifications
C09J2423/10
METHOD OF ADHERING EXTENDED MELT-TEMP RANGE AND LOW ENERGY ABSORPTIVE EDGE BANDING ADHESIVE SYSTEM EDGE BANDING
A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.
METHOD OF ADHERING EXTENDED MELT-TEMP RANGE AND LOW ENERGY ABSORPTIVE EDGE BANDING ADHESIVE SYSTEM EDGE BANDING
A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.
Multi-Phasic Polymer Blend for Adhering an Outer Edge Banding Layer to a Substrate
A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.
LABEL OR LABEL FACESTOCK WITH POST-CONSUMER RECYCLE CONTENT
A label and a facestock for a label, wherein the facestock includes a first facestock material and a second facestock material. The first facestock material includes post-consumer recycle content, and the second facestock material includes desirable characteristics, e.g., a density of less than 1 g/cm.sup.3.
PERMANENTLY TACKY ADHESIVES WITH IMPROVED ENVIRONMENTAL COMPATIBILITY
The invention provides resin- and mineral oil-free pressure-sensitive adhesive compositions, comprising 55%-100% by weight of a copolymer of propylene and one or more further monomers selected from the group composed of ethylene and 1-olefins having 4 to 20 carbon atoms, wherein the copolymer has been prepared with the aid of metallocene catalysts and is characterized by a. a melt viscosity at 170° C. of 20 to 8000 mPas (DIN 53019); b. a density of 0.84 to 0.90 g/cm.sup.3 (23° C., ISO 1183); c. a glass transition temperature of less than −30° C. (DIN EN ISO 11357-2:2014); and d. a flow point, measured according to ASTM D97, of less than 50° C.,
which due to their permanently tacky properties are suitable as pressure-activated pressure-sensitive adhesives.
DEGRADABLE EVOH HIGH-BARRIER COMPOSITE FILM
A degradable EVOH high-barrier composite film, characterized in that the materials of various layers in the composite film all obtain approximately-consistent biodegradability by introducing biomass, and the additive amount of the additive master batch in the materials of each layer is controlled within the range of 0.3-15% of the total mass of the materials of the corresponding layer; the hydrophilic activity of the hydrophilic groups in the additive master batch should be greater than or equal to that of the hydrophilic groups in the materials of each layer; by adding the additive master batch, the mole ratios of the hydrophilic groups to carbon atoms of the materials of various layers tend to be consistent, namely, the bioactivities tend to be consistent, so that the degradation rates of the materials of various layers in the composite film tend to be consistent. The present invention makes contribution to obtaining approximately-consistent bioactivities and approximately-consistent biodegradation rates by balancing the mole ratios of the hydrophilic groups to carbon atoms in the materials of various layers, and the appearance, the functions and the physical and mechanical properties of a product remain unchanged.
HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Dielectric-heating bonding film and joining method using dielectric-heating bonding film
A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 μm, a thickness of the dielectric welding film ranging from 10 to 2,000 μm. The method uses the dielectric welding film.
Floor coverings and floor covering systems and methods of making and installing same
Floor coverings having a greige good, an adhesive layer, and a secondary backing material. The greige good has a primary backing component having adjoined first and second portions, and a plurality of fibers. The secondary backing material has an attached portion and a first exposable portion, with the attached portion adhered to the first portion of the primary backing component by contact with the adhesive layer. The second portion of the primary backing component is unattached to the first exposable portion of the secondary backing material, and the first exposable portion defines a portion of the first end edge of the floor covering. The second portion of the primary backing component is selectively moveable relative to the first portion to a position in which at least a portion of the second portion of the primary backing component does not overlie the first exposable portion of the secondary backing material.
HOT MELT ADHESIVE COMPOSITION HAVING LOWER MELT VISCOSITY
This invention relates to a hot melt adhesive composition. In particular, the present invention relates to a hot melt pressure sensitive adhesive composition having lower melt viscosity under lower application temperature, excellent peel strength when cured, and lower odour.