To provide a hot melt adhesive agent which is excellent in adhesive properties to a substrate material such as paper and a polyolefin, is also excellent in adhesive properties from a low temperature (around 4° C.) to a high temperature (around 50° C.), has little viscosity change even when a long time elapses, and has tack that is not too high. Provided is a hot melt adhesive agent for a container with a straw comprising an amorphous poly-α-olefin (A) and a metallocene polymer (B).

The present application relates to an adhesive composition comprising a polypropylene resin, a tackifying resin and a plasticizer resin having a superior balance of properties in regard of Brookfield viscosity and maximum probe tack. It further relates to an article comprising the adhesive composition and to a process for producing said article. The application also relates to the use of the adhesive composition in the preparation of an article.

A hotmelt adhesive composition comprising 15 to 45% by weight of at least one tackifying resin, and 20 to 60% by weight of a mixture of at least one single-site catalyzed propylene homopolymer (A) and at least one propylene copolymer (B), wherein the propylene homopolymer (A) has a weight average molecular weight of 20,000 to 145,000, the propylene copolymer (B) has an ethylene comonomer content of 5 to 25% by weight, and the weight ratio of propylene homopolymer (A) to propylene copolymer (B) is from 1:3 to 3:1, wherein the hotmelt adhesive further comprises at least one of the following two components (a) and (b): (a) a particulate phosphorous based compound in an amount of 15 to 40% by weight, or (b) a room temperature liquid phosphorous based compound in an amount of 4 to 15% by weight.

The problem of the invention is to provide a hot-melt adhesive having reduced thread formation at the time of applying, excellent thermal resistance and thermal stability after bonding. The means for solving the problem is a hot-melt adhesive comprising a copolymer of ethylene and olefins having 3 to 20 carbon atoms (A), a copolymer of ethylene and carboxylate esters having ethylenically double bonds (B), a tackifying resin (C) and a wax (D), wherein the copolymer of ethylene and olefins having 3 to 20 carbon atoms (A) comprises a metallocene-type propylene/ethylene copolymer (A1).

Objective of the invention is to provide a hot-melt adhesive excellent in thermal resistance, good in adhesiveness over a wide range from low temperature to high temperature, and also excellent in thermal stability. Means for solving the problem is a hot-melt adhesive comprising an olefin copolymer (A), a tackifying resin (B) and a wax (C), wherein the olefin copolymer (A) comprises a metallocene-type ethylene/α-olefin copolymer (A1) having a melting point of 100 to 140° C.

Embodiments of the present disclosure are directed to coextruded multilayer films comprising a comprising a plurality of layers, wherein at least one layer comprises the thermoplastic adhesive composition, the thermoplastic adhesive composition comprising: at least one maleic anhydride-grafted ethylene-based polymer; at least one at least one ethylene/α-olefin/non-conjugated diene interpolymer having a molecular weight distribution (MWD)≥2.5, wherein MWD=Mw/Mn, wherein Mw is weight averaged molecular weight and Mn is number averaged molecular weight, which are both determined by gel permeation chromatography; and a very low density polyethylene (VLDPE) having a density in the range 0.885 to 0.915 grams/cm.sup.3.

A sealing device includes a waterproofing membrane, an adhesive sealant layer, and optionally a release liner, wherein the adhesive sealant layer includes at least one elastomer, at least one at 25° C. liquid polyolefin resin, and at least one inert mineral filler. An adhesive sealant composition is used to form the adhesive sealant layer. The sealant device may be used to waterproof a substrate and provide a fully-adhered roof system. The adhesive sealant composition may be used to provide a self-healing roofing membrane.

A hotmelt composition comprises at least three co-polymers defined by their chemistry and molecular weight. The hotmelt composition may be without tackifiers. The hotmelt can be used in absorbent articles such as diapers comprising two substrates at least partially attached by the hotmelt composition. The hotmelt provides especially good nonwoven-nonwoven bond and nonwoven-film bond.

Provided is an adhesive composition that is characterized by containing a modified polypropylene-based resin (A), an epoxy resin (B) and an unmodified polypropylene-based resin (C), with the modified polypropylene-based resin (A) being a resin obtained by graft modifying an unmodified polypropylene-based resin (D) with a modifying agent that contains an ,-unsaturated carboxylic acid or a derivative thereof, the content of the modified polypropylene-based resin (A) being 10 mass % or more in terms of solid content, and the content of the unmodified polypropylene-based resin (C) being 1-90 mass % in terms of solid content. The adhesive composition exhibits good adhesion to a copper foil or a base material film comprising a polyimide resin or the like, and exhibits improved dielectric properties.

A hotmelt composition comprises at least three co-polymers defined by their chemistry and molecular weight. The hotmelt composition may be without tackifiers. The hotmelt can be used in absorbent articles such as diapers comprising two substrates at least partially attached by the hotmelt composition. The hotmelt provides especially good nonwoven-nonwoven bond and nonwoven-film bond.