The present invention comprises a single-component binder for heat-sealing applications which can be used for the sealing of polyester foils, in particular of polyethylene terephthalate foils (PET foils) with respect to containers made of polystyrene, of PVC, and of polyester. These polyesters can in particular be polyethylene terephthalate (PET) or polylactic acid (PLA). The binders here feature not only good seal seam strengths but also in particular good transparency and excellent application properties. A substantive aspect of the invention is that the sealing can be achieved without addition of adhesion promoters, in particular without addition of adhesion promoters based on polyvinyl chloride (PVC) or on polyester, and that barrier properties and sealing properties achieved in respect of containers made of PS and of PET are nevertheless at least comparable with, and sometimes better than, those achieved with heat-sealing systems already marketed.

The invention relates an adhesive tape, particularly wrapping tape for wrapping cables in automobiles, comprising a textile carrier, and an adhesive coating on at least one face of the carrier, characterized in that the textile carrier is produced, at least to some extent, from bio-based polymers.

The present invention provides a damping material and a damping sheet made therefrom. Specifically, the present invention provides a damping material comprising 10-50 wt % of a block copolymer elastomer; 5-40 wt % of a specific-length fiber; 5-45 wt % of a thermoplastic non-elastomeric polymer; 5-50 wt % of a tackifier; 0-50 wt % of an inorganic filler; and 0-30 wt % of a flame retardant based on the total weight of the damping material. The damping material and the damping sheet made therefrom according to the present invention have high damping properties, a wide application temperature range and a low density, and can serve as a novel damping material in the current automobile, rail transit, construction and electrical appliance industries.

The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

The disclosure relates to a thin layer comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layer comprising the catechol containing polymer or oligomer. The disclosure also relates to a thin layer comprising a catechol containing polymer or oligomer adjacent to and in contact with a bulk adhesive layer. The layers demonstrate improved adhesion between coral and coral-like materials.

The disclosure relates to a thin layer comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layer comprising the catechol containing polymer or oligomer. The disclosure also relates to a thin layer comprising a catechol containing polymer or oligomer adjacent to and in contact with a bulk adhesive layer. The layers demonstrate improved adhesion between coral and coral-like materials.

Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2). (1) When the cushion layer is cut out using the dumbbell from JISZ1702 and is stretched 25% at a gauge length of 40 mm and a tensile speed of 300 mm/min, the tensile stress is 2-30N/10 mm. (2) The cushion layer is formed from a thermoplastic resin that has a melt flow rate (JISK7210, 125° C./10.0 kg load) of 0.2-30 g/10 min, and a melting point of 60-110° C.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

A label as shown and described herein. The label may include a label substrate, an adhesive adjacent the substrate, and a liner adjacent the adhesive, such that the adhesive is disposed between the label substrate and the liner, and wherein the label substrate is embossed or debossed, and the liner is not embossed or debossed.