Patent classifications
C09J2427/006
LAMINATE FLOOR AND MANUFACTURING PROCESS THEREOF
Disclosed is a composite floor, comprising a wear-resistant layer, a polyvinyl chloride patterned fabric layer, a base material layer, a balance layer, and a muting layer that are sequentially arranged, the wear-resistant layer being a melamine wear-resistant paper layer. The composite floor has a clear and vivid pattern, and the wear and scratch resistance is far better than that of a conventional floor, the manufacturing process comprising laying, hot pressing, demolding and tempering steps. The manufacturing process has simple steps, and the obtained composite floor has high dimensional stability and good wear and scratch resistance.
COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME
The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
METHOD FOR MANUFACTURING HIGH TEMPERATURE-RESISTANT POLYVINYL CHLORIDE ADHESIVE TAPE
The present invention relates to a method for manufacturing a high temperature-resistant polyvinyl chloride adhesive tape, and more particularly to a method and a production process for manufacturing a high temperature-resistant adhesive tape by applying a UV-crosslinkable hot-melt pressure-sensitive adhesive to a high temperature-resistant polyvinyl chloride film. The high temperature-resistant polyvinyl chloride film is a high temperature-resistant material containing a liquid polymeric plasticizer, a solid polymeric plasticizer, and a heat stabilizer. The hot-melt pressure-sensitive adhesive can be directly coated onto the high temperature-resistant polyvinyl chloride film at 130-150° C.; and then crosslinked and cured by UV irradiation, to make a high temperature-resistant polyvinyl chloride adhesive tape. Compared with conventional polyvinyl chloride adhesive tapes, the high temperature-resistant polyvinyl chloride adhesive tape manufactured using the method for manufacturing a novel high temperature-resistant polyvinyl chloride adhesive tape provided in the present invention has the advantages of non-volatility and resistance to high temperature and is highly environmentally friendly.
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.
ADHESIVE-COATED THERMALLY SENSITIVE POLYMER SUBSTRATE, PROCESS FOR ITS MANUFACTURE AND USE THEREOF
The invention relates to an adhesive-coated polymer substrate comprising (a) a polymer substrate containing or consisting of a thermoplastic polymer with a Vicat A50 softening point according to DIN EN ISO 306 of up to 220° C., and (b) an adhesive composition coated directly on at least one side of the polymer substrate, wherein the adhesive composition (b) is a UV-curable or UV-cured hot melt pressure sensitive adhesive (PSA). The invention relates moreover to a process for the manufacture of the adhesive-coated polymer substrate as well as to the use thereof.
FILM AND METHOD OF MANUFACTURING FLUORORESIN COMPOSITION
An object of the invention is to provide a film having excellent weatherability. The present invention provides a film comprising: a base layer formed of a thermoplastic resin, and a fluororesin layer laminated to one face of the base layer, wherein the fluororesin layer contains a tetrafluoroethylene resin and a photostabilizer. The present invention also provides a method of manufacturing a fluororesin composition suitable for manufacturing the film. The method of manufacturing comprises a dissolving step in which a photostabilizer is dissolved in ester-based, ketone-based, or aromatic solvent to obtain a solution and a mixing step in which the solution is mixed with a fluororesin comprising tetrafluoroethylene resin.
Skin-adhesive item
A skin-adhesive item is described that can include a substrate F coated continuously or discontinuously on at least one of the two faces thereof by a pressure-sensitive silicone adhesive Z that has been previously sterilized by means of gamma radiation and demonstrates good tack on the skin even after sterilization.
Moisture Curable Adhesive Compositions
A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.
ADHESIVE FORMULATIONS INCLUDING AT LEAST ONE SILYL MODIFIED POLYMER
Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not limited to, at least one moisture scavenger, at least one adhesion promoter, at least one catalyst, at least one filler, at least one plasticizer, at least one antioxidant, or any combination thereof. In some embodiments, the adhesive formulation may exclude a low viscosity polymer. In some embodiments, the adhesive formulation may include a low viscosity polymer in no more than a specified amount. At least one method of using the adhesive formulation and at least one roofing system comprising the adhesive formulation are also described herein.