A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

A film-based article including a release liner having first and second major sides, a film layer having first and second major sides, an adhesive layer disposed between the first major side of the release liner and the second major side of the film, wherein the adhesive layer comprises a first surface adjacent to the second major side of the film, and a second surface adjacent to the first major side of the release liner. The second surface of the adhesive layer comprises an irregular array of channels.

Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not limited to, at least one moisture scavenger, at least one adhesion promoter, at least one catalyst, at least one filler, at least one plasticizer, at least one antioxidant, or any combination thereof. In some embodiments, the adhesive formulation may exclude a low viscosity polymer. In some embodiments, the adhesive formulation may include a low viscosity polymer in no more than a specified amount. At least one method of using the adhesive formulation and at least one roofing system comprising the adhesive formulation are also described herein.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not limited to, at least one moisture scavenger, at least one adhesion promoter, at least one catalyst, at least one filler, at least one plasticizer, at least one antioxidant, or any combination thereof. In some embodiments, the adhesive formulation may exclude a low viscosity polymer. In some embodiments, the adhesive formulation may include a low viscosity polymer in no more than a specified amount. At least one method of using the adhesive formulation and at least one roofing system comprising the adhesive formulation are also described herein.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

Method of improving shear stability of highly concentrated aqueous adhesive polymer compositions comprising a specific adhesive polymer which has been prepared by emulsion polymerization and which is dispersed in the aqueous adhesive composition. Said method comprises treating the aqueous adhesive polymer composition with at least one anion exchange resin.

The invention relates to a process for polymerizing at least one radically polymerizable compound having at least one ethylenic bond in the presence of a borane complex BH3 with an amine as a radical initiator, said process comprising the steps of: providing a borane complex BH3 with an amine; and bringing the complex into contact with a composition comprising at least one radically polymerizable compound having at least one ethylenic bond; wherein the polymerization is performed in the absence of an oxidizing agent and/or an additional radical initiator other than the borane complex BH3 with an amine. The invention also relates to a composition comprising at least one radically polymerizable compound having at least one ethylenic bond and a borane complex BH3 with an amine, wherein the composition is free of an oxidizing agent and/or an additional radical initiator other than the borane complex BH3 with an amine, as well as the use of said composition as an adhesive for bonding two substrates together.