Provided are a pressure-sensitive adhesive composition for an optical film, which has excellent optical compensation and stress relaxation properties without changing main properties such as endurance reliability and workability under a high temperature and/or high humidity condition to minimize a light leakage phenomenon caused by stress concentration of a protective film, and an optical member and a liquid crystal display device which include a pressure-sensitive adhesive layer manufactured using the same.

Provided are a protective film and a back grinding method for a semiconductor wafer, which can suppress occurrence of suction defect. A protective film is a film that protects a surface of a semiconductor wafer on which a circuit is formed when a back surface of the semiconductor wafer is ground in a state where the surface of the semiconductor wafer is sucked to a fixture. The protective film has a pressure-sensitive adhesive layer, a base material layer, and an auxiliary layer. The pressure-sensitive adhesive layer is a layer to be stuck to the semiconductor wafer, the auxiliary layer is a layer to be contact to the fixture, and the semiconductor wafer is a semiconductor wafer having a level difference on an outer peripheral edge of the surface on which the circuit is formed.

Provided are a protective film and a back grinding method for a semiconductor wafer, which can suppress occurrence of suction defect. A protective film is a film that protects a surface of a semiconductor wafer on which a circuit is formed when a back surface of the semiconductor wafer is ground in a state where the surface of the semiconductor wafer is sucked to a fixture. The protective film has a pressure-sensitive adhesive layer, a base material layer, and an auxiliary layer. The pressure-sensitive adhesive layer is a layer to be stuck to the semiconductor wafer, the auxiliary layer is a layer to be contact to the fixture, and the semiconductor wafer is a semiconductor wafer having a level difference on an outer peripheral edge of the surface on which the circuit is formed.

A laminated adhesive tape includes a substrate comprising two or more plies of thin, flexible material, the substrate having a first major surface and a second major surface opposite the first major surface. A polymeric laminating composition comprising a polymer and an alkyl ketene dimer binds the two or more plies and a pressure sensitive adhesive carried on the first major surface. In a further aspect, a method of making a laminated adhesive tape is provided.

In an embodiment, a topcoat for a thermo-printable tape with a smooth printable surface includes a polymer blend, a crosslinker, a pigment, and a solvent. In one or more embodiments, the polymer blend includes a polyether polyurethane, a vinyl copolymer, and an epoxy polymer. In one or more embodiments, a thermo-printable tape with a smooth printable surface includes a topcoat layer, a basecoat layer, and a base substrate. In one or more embodiments, a topcoat layer is disposed on the basecoat layer. The basecoat layer is disposed on the base substrate. In one or more embodiments, the base substrate may include a first base layer, a second base layer and a support layer between the first and second base layers. One or more embodiments include a method of forming a thermo-printable tape.

A black sheet (1) includes a laminate of a base sheet (11) and an infrared reflecting layer (12). The CIE color values (L*, a*, b*) and the infrared reflectance R/[%] at a wavelength of 850 nm are within the following respective ranges. 18≤L*≤36, −3≤a*≤3, −3≤b*≤3, 12≤R

A method of forming a graphic article is described such as a tape or sheet, comprising a PLA-based film. The PLA-based film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; and plasticizer. The graphic article is typically a tape or sheet that may further comprise a (e.g. pressure sensitive) adhesive and a low adhesion backsize or a release liner. The graphic article can be suitable for various end-uses.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

Presently described are polylactic acid polymer based films comprising a structured surface and articles. In one embodiment, the film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; and plasticizer. Articles are also described such as a tape or sheet, comprising the structured PLA-based film and a layer of (e.g. pressure sensitive) adhesive disposed on the film. In some embodiments, the tape or sheet further comprises a low adhesion backsize or a release liner. The article can be suitable for various end-uses. In one embodiment, the tape is a paint masking tape. In another embodiment, the tape is a floor marking tape.

A pre-laid polymer waterproof rolling material, which comprises a sheet-like polymer carrier, a hot-melt pressure-sensitive adhesive layer on the sheet-like polymer carrier, and an anti-sticking coating on the hot-melt pressure-sensitive adhesive layer; The anti-sticking coating comprises the following components: 100-160 parts by weight of water; 50-80 parts by weight of a polyurethane resin; 15-20 parts by weight of a pigment; 10-12 parts by weight of a filler; 0.3-1 part by weight of a cross-linking agent; 0.5-1 part by weight of an antioxidant; 1-2.5 parts by weight of an anti-ultraviolet agent; and 0.03-0.2 part by weight of a thickener. The anti-sticking coating in the present application uses water as a solvent, water is non-toxic and non-corrosive, thus there is no environmental pollution problem in the production process.