Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m.sup.2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.

A decorative object assembly for attachment to a vertical surface includes a substantially planar decorative block defining an upper edge and a lower edge. A flexible planar strip is made of a thermoplastic polymer, and defines an upper edge parallel to the upper edge of the block, a lower edge parallel to the lower edge of the block, and a vertical direction between the upper and lower edges. A first layer of adhesive extends vertically downward from the upper edge of the strip, for releasable attachment to the vertical surface. An attachment mechanism for attachment to the decorative block is configured on a lower vertical section of the planar strip. A gap section of the strip is vertically located between the first layer of adhesive and the lower vertical section, on which no adhesive is adhered.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%. The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.

Provided are functionalized polypropylene adhesive compositions having a desirable range of melt flow rate. These compositions are obtained by grafting at least one impact polypropylene copolymer or by co-grafting a blend containing at least one impact polypropylene copolymer and at least one random polypropylene copolymer. The polypropylene copolymer(s) are grafted with one or more ethylenically unsaturated carboxylic acids or derivatives of these acids, such as anhydrides. Maleic anhydride is a preferred grafting monomer. Also provided is a multilayer film or sheet structure containing at least one barrier layer and at least one adhesive layer produced from the functionalized polypropylene adhesive composition. The multilayer film or sheet structure may also contain at least one predominantly polypropylene-based layer. In addition, a multilayer film or sheet structure is provided in which a barrier layer or a primer layer is adjacent to at least one layer that is produced from a dry blend or a melt blend of the functionalized polypropylene adhesive composition with a polypropylene matrix polymer.

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

Packaged viscoelastic polymer substances and methods for the production of the packaged viscoelastic polymer substances are provided. The packaged viscoelastic polymer substances are further processable under the influence of heat and shear.

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?.Math.cm.

The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?.Math.cm.