A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

An article is described such as a tape or sheet, comprising a PLA-based film and a layer of (e.g. pressure sensitive) adhesive disposed on the film. The PLA-based film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25 C.; and plasticizer. The tape or sheet may further comprises a low adhesion backsize or a release liner. The article can be suitable for various end-uses. In one embodiment, the tape is a paint masking tape. In another embodiment, the tape is a floor marking tape.

An article is described such as a tape or sheet, comprising a PLA-based film and a layer of (e.g. pressure sensitive) adhesive disposed on the film. The PLA-based film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25 C.; and plasticizer. The tape or sheet may further comprises a low adhesion backsize or a release liner. The article can be suitable for various end-uses. In one embodiment, the tape is a paint masking tape. In another embodiment, the tape is a floor marking tape.

A hot melt adhesive film for bonding an ethylene-vinyl acetate form and a rubber includes a hot melt adhesive film layer and a release film layer. The hot melt adhesive film layer is prepared by the following raw materials in parts by weight: a 20-50 parts by weight of polyethylene-ester copolymer, a 5-15 parts by weight of rubber, a 15-55 parts by weight of thermoplastic polyolefin, a 5-20 parts by weight of tackifier and a 5-30 parts by weight of auxiliary. The release film layer is releasably adhered to the hot melt adhesive film layer.

A hot melt adhesive film for bonding an ethylene-vinyl acetate form and a rubber includes a hot melt adhesive film layer and a release film layer. The hot melt adhesive film layer is prepared by the following raw materials in parts by weight: a 20-50 parts by weight of polyethylene-ester copolymer, a 5-15 parts by weight of rubber, a 15-55 parts by weight of thermoplastic polyolefin, a 5-20 parts by weight of tackifier and a 5-30 parts by weight of auxiliary. The release film layer is releasably adhered to the hot melt adhesive film layer.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

A mask-integrated surface protective tape for production of semiconductor chips, with the production containing steps (a) to (d), which tape comprises a base film and a mask material layer provided thereon, wherein a wetting tension of the base film on the side from which the mask material layer has been peeled is from 20.0 mN/m to 48.0 mN/m, and wherein a surface roughness Ra of the base film on the side from which the mask material layer has been peeled is within a range from 0.05 m to 2.0 m when measured in conformity to JIS B0601, (a) a specific laminating step; (b) a specific peeling step; (c) a specific plasma-dicing step; and (d) a specific ashing step.

A graphic article comprising a Poly lactic acid (PLA) based film and in particular, an ink layer depicting a graphic is described. The PLA based film comprises a semicrystalline polylactic acid polymer, a second of a polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25 C., and plasticizer. The article is typically a tape or sheet that may further comprise an adhesive (e.g. pressure sensitive) and a low adhesion backsize or a release liner. A method of forming a graphic article using the film of the invention is also disclosed.

Methods of forming laminating adhesive articles include providing a multi-layer article, an embossing tool with a structured surface, and a support surface tool. The multi-layer articles include a substrate, an adhesive layer, and a liner or may just include an adhesive layer and a liner. The multi-layer article is placed between the structured surface of the embossing tool and the support surface tool. The embossing tool is pressed against the liner and the support surface tool is simultaneously pressed against the substrate by applying pressure or a combination of pressure and heat. The pressing causes the structures on the surface of the embossing tool to distort the liner and the adhesive layer and the support surface tool modifies the surface of the substrate. The distortion in the liner is retained upon release of the applied pressure. Upon removal of the liner from the adhesive layer, the structures on the adhesive layer are unstable, but do not immediately collapse.