Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Articles are described such as optical films and optical film stacks 2000. The articles include a substrate 2070 and a primer layer 2075 disposed on the substrate wherein the primer layer comprises a polyacrylate and a nitrogen-containing polymer. The article further includes an adhesive layer 2060 disposed onto the primer layer wherein the adhesive layer comprises a polyacrylate component. In some embodiments, the adhesive is further bonded to a second substrate 2010 or a release liner.

The aim of the invention is to provide polyester/primer/metallic coating composite films having good adherence of the metallic coating in dry and humid conditions. Said films also form a good gas barrier: oxygen permeability less than or equal to 0.8 cc/m2/d; water vapour permeability less than or equal to 0.3 g/m2/d. To this end, the invention concerns a composite film comprising a polyester substrate, at least one coating adhering on at least one of the faces of the substrate and at least one layer of primer for cross-linked adhesion between the substrate and the coating. Said primer comprises at least one acrylic and/or methacrylic polymer P1, at least one acrylic and/or methacrylic polymer P2 different from P1, at least one cross-linking agent, and, preferably, at least one polyester that is soluble or dispersible in water: P1 having a gel content TG1>70% by dry weight with respect to P1; P2 having a gel content TG2TG1 and 20% by dry weight, with respect to P2; P1 having a surface-grafted free weak acid content >0.8 in meq/g of polymer; [P2]60% by weight on dry by weight in respect to P1+P2. The method for producing said film, the adhering primer, and the articles obtained using said film, also form part of the present invention.

The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 m or less.

Provided is a composition for an adhesive layer of a non-aqueous secondary battery allowing formation of an adhesive layer that can achieve both high process adhesiveness and high blocking resistance in battery members such as an electrode and a separator. The presently disclosed composition for an adhesive layer of a non-aqueous secondary battery includes a particulate polymer A that has a glass-transition temperature of no higher than 20? C. and a volume-average particle diameter of at least 100 nm and less than 450 nm, and a particulate polymer B that has a glass-transition temperature of at least 30? C. and less than 60? C. and a volume-average particle diameter larger than the volume-average particle diameter of the particulate polymer A.

A laminate comprising a substrate layer; a contact adhesive layer comprising a contact adhesive agent having at least one of chloroprene rubber or acrylic copolymers, as well as microspheres having an average particle size of 0.5 m or greater in the contact adhesive layer, wherein the contact adhesive layer contains from 5 parts by mass to 500 parts by mass of the microspheres per 100 parts by mass of the contact adhesive agent, and the contact adhesive layer has a plurality of protruding portions because of the microspheres.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.