Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

A sealing for arrangement between a wall and a wall covering includes a sealing sheet and an adhesive tape. The sealing sheet and the adhesive tape each have a carrier layer of a preferably closed-cell foam plastic. Furthermore, the sealing sheet can bear a nonwoven fabric preferably on the wall-facing side, wherein border strips remain free of the nonwoven fabric for underlapping with an adhesive tape.

The heat-shielding heat insulating substrate is a heat-shielding heat insulating substrate including a transparent substrate layer and an infrared reflection layer, the heat-shielding heat insulating substrate including: a protective topcoat layer arranged on a side of the infrared reflection layer opposite to the transparent substrate layer; and a protective film arranged on a surface of the protective topcoat layer opposite to the infrared reflection layer, wherein a 180° peel strength of the protective film to the protective topcoat layer under an environment having a temperature of 23±1° C. and a humidity of 50±5% RH is from 0.01 N/50 mm to 0.40 N/50 mm, and wherein a 180° peel strength of the protective film to the protective topcoat layer after storage of the heat-shielding heat insulating substrate under an environment having a temperature of 80±1° C. for 10 days is from 0.01 N/50 mm to 1.0 N/50 mm.

A laminated film preferable as a PPF material. The laminated film is formed, in which a coating layer formed of a cured material of a photopolymerizable coating liquid, a base material layer formed of thermoplastic polyurethane, and an adhesive layer formed of a pressure sensitive adhesive are formed in contact with each other in the order, the photopolymerizable coating liquid is composed of component (a): urethane acrylate and component (b): photopolymerizable acrylic compounds having no urethane unit and containing a fluorine atom, and component (a) and component (b) are mixed at a proportion of (a): 20% by weight or more and less than 50% by weight and (b): 50% by weight or more and less than 80% by weight, based on 100 parts by weight of the photopolymerizable coating liquid.

A laminated film preferable as a PPF material. The laminated film is formed, in which a coating layer formed of a cured material of a photopolymerizable coating liquid, a base material layer formed of thermoplastic polyurethane, and an adhesive layer formed of a pressure sensitive adhesive are formed in contact with each other in the order, the photopolymerizable coating liquid is composed of component (a): urethane acrylate and component (b): photopolymerizable acrylic compounds having no urethane unit and containing a fluorine atom, and component (a) and component (b) are mixed at a proportion of (a): 20% by weight or more and less than 50% by weight and (b): 50% by weight or more and less than 80% by weight, based on 100 parts by weight of the photopolymerizable coating liquid.

A mask-integrated surface protective tape for production of semiconductor chips, with the production containing steps (a) to (d), which tape comprises a base film and a mask material layer provided thereon, wherein a wetting tension of the base film on the side from which the mask material layer has been peeled is from 20.0 mN/m to 48.0 mN/m, and wherein a surface roughness Ra of the base film on the side from which the mask material layer has been peeled is within a range from 0.05 μm to 2.0 μm when measured in conformity to JIS B0601, (a) a specific laminating step; (b) a specific peeling step; (c) a specific plasma-dicing step; and (d) a specific ashing step.

A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

Provided is a photocurable adhesive sheet having both step conformability and shape stability and also excellent in durability after attachment to an adherend member.

The photocurable adhesive sheet includes a first adhesive layer, a second adhesive layer, and an intermediate layer interposed between the first adhesive layer and the second adhesive layer, and is characterized in that the intermediate layer is a layer that is formed from a resin composition containing a (meth)acrylic copolymer as a main component resin and has a crosslinked structure, the first adhesive layer, the second adhesive layer, or both of these layers are photocurable resin layers each formed from a photocurable resin composition, and the fall time in the measurement of holding force at 40° C. under a load of 1 N/cm.sup.2 is 60 minutes or more, while the fall time in the measurement of holding force at 60° C. under a load of 1 N/cm.sup.2 is less than 60 minutes.

Printable films, such as retroreflective, graphic and label film materials, comprising a substrate layer, which is formed from a composition comprising a polymethyl methacrylate and an acrylic copolymer comprising hard segments and soft segments, and products formed therefrom are disclosed. Methods of improving print quality of a printable are also disclosed.