Provided is a PSA sheet capable of bringing about good air release properties in mobile electronic applications. The present invention provides a PSA sheet for mobile electronics. The PSA sheet comprises a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA layer has a thickness of 20 m or less. The PSA sheet further comprises a coating layer that partially covers the PSA layer surface. The coating layer has a thickness less than 3 m.

The object of the present invention is to provide a decorative film excellent in moldability and tensile strength; and a method for producing a three-dimensionally molded article with a decorative film. The decorative film of the present invention is used for decorating a three-dimensionally molded article. It is a decorative film comprising at least a substrate film layer and a clear layer, wherein the clear layer is made of a fluorinated polymer comprising units based on a fluoroolefin, units based on a monomer having no crosslinkable group, which is at least one member selected from the group consisting of a vinyl ether, a vinyl ester, an allyl ether, an allyl ester and a (meth)acrylic acid ester, and units having a crosslinkable group; and the content of the units based on a fluoroolefin is from 20 to 70 mol % to all units which the fluorinated polymer comprises.

Systems and methods transfer diecuts from a liner layer to a surface. One method may transfer a diecut from the liner layer to the surface by means of an applicator, wherein a ratio of the pull-off force of the diecut from the liner layer in the z direction to the pull-off force of the diecut from the surface in the z direction is at most 0.18. The method may enable particularly reliable and firm transfer of the diecut from a diecut tape to a surface where bonding is to take place. As a result, it may be possible for the frequency of errors in the bonding of plastics parts to be relevantly reduced.

The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa.Math.s to 80,000 Pa.Math.s, when measured at 120 C. according to the test method described in the experimental section.

The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.

A coating sheet for preventing adhesion of advertising materials includes a soft sheet made with a synthetic resin; a protective layer formed on one of the two surfaces of the soft sheet to protect the sheet from decoloration by the ultra-violet rays in the sunlight; a first coating layer formed on the protective layer and provided with a plurality of small projections; a second coating layer formed as a film on the first coating layer; an adhesive layer formed on the opposite side of the soft sheet for attaching the soft sheet; and a release paper layer positioned underside (exposed surface of) the adhesive layer to protect the adhesive layer from being contaminated by foreign materials and losing adhesive power. The coating sheet can be attached to public or private installation, such as walls, poles, street lights, or traffic lights, to prevent adhesion of unlawful advertising materials on the installation.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23 C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23 C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60 C.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23 C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23 C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60 C.