A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.

Provided are adhesive articles and related methods that use a foam layer including an acrylic polymer or silicone polymer and having a pair of opposing major surfaces. An adhesive surface is disposed on each of the opposing major surfaces and a plurality of channels extend across at least one adhesive surface. The adhesive surface defining the channels contains a pressure-sensitive adhesive having a rheology enabling the plurality of channels to essentially disappear over time when the adhesive article is compressed. Advantageously, the provided articles and methods enable high immediate bond and handling strength, a high degree of wet out, weatherability, and superior aesthetics when used with transparent or translucent substrates.

A water barrier laminate including inorganic barrier and water-trapping layers alternately arranged in order from the side facing the device to the outer side: a first inorganic barrier layer, a first water-trapping layer, a second inorganic barrier layer, a second water-trapping layer and a third inorganic barrier layer. A water-permeable underlying plastic layer is provided on one side of these inorganic barrier layers; a distance L1a between the first water-trapping layer and the first inorganic barrier layer and a distance L2a between the second water-trapping layer and the second barrier satisfy formulas (1) and (2):

L1a<3 μm  (1)

L2a<3 μm  (2)

and a distance L1b between the second inorganic barrier layer and the first water-trapping layer satisfies formula (3):

L1b≤3 μm  (3)

by interposing a water-permeable organic layer therebetween.

A double-sided pressure-sensitive adhesive strip is provided that includes a pressure-sensitive adhesive strip comprising two opposing strip surfaces configured for bonding. At least one conductive component connects the two opposing strip surfaces configured for bonding in the z-direction. Also provided is a component and/or a composite, which is bonded with the conductive pressure-sensitive adhesive strip. Further, uses are provided of the conductive pressure-sensitive adhesive strip.

A recording paper includes: a laminated resin film including a substrate composed of a thermoplastic resin film and an underlayer disposed on at least one side of the substrate and composed of a thermoplastic resin composition; and a resin coating disposed facing the underlayer of the laminated resin film, wherein the underlayer has an indentation modulus of 50 to 1200 MPa, the resin coating contains a resin that is a reaction product of a cationic water-soluble polymer and a silane coupling agent, a content of a silane coupling agent component is 15 to 60 parts by mass with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating, the resin coating is free from thermoplastic resin particles, and a content of an inorganic filler is 9 parts by mass or less with respect to 100 parts by mass of the cationic water-soluble polymer component in the resin coating.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.

The present invention relates to a protective film for a windshield of a vehicle, which can be installed on a curved portion of the windshield of the vehicle without a thermoforming process, thereby improving the workability of a worker, and improving impact resistance to effectively protect the windshield of the vehicle.

The present invention relates to a protective film for a windshield of a vehicle, which can be installed on a curved portion of the windshield of the vehicle without a thermoforming process, thereby improving the workability of a worker, and improving impact resistance to effectively protect the windshield of the vehicle.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.