C09J2463/006

Surface treatment to enhance bonding of composite materials

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer containing blocked isocyanate compounds is applied onto a curable composite substrate, followed by co-curing. The surface treatment layer may be a resin layer without fibers or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

POLYMER COMPOSITION

The present invention relates to a polymer composition comprising (A) from 60 to 90 wt % of a non-elastomeric polyethylene; (B) from 9.0 to 38 wt % of an elastomer; wherein onto component (A) or components (A) and (B) an acid grafting agent (C) has been grafted in an amount of from 0.01 to 3.0 wt %, all based on the total weight of the polymer composition, and wherein the polymer composition has two distinct peaks and a valley between said peaks in the GPC curve and a Z value, determined from the areas below the two peaks of the GPC curve, of at least −0.3, wherein the Z-value is determined according to formula (I) Z=s/Abs(B−A) (I) wherein Abs(B−A) is the absolute value of (B−A); A=the area, between the tangent parallel to the MW axis going through log M (Min) and the LS15 signal, from log M of 5.1 to log M value where the LS signal is minimum log M (Min), in the log M range between 5.1 and 6; B=the area, between the tangent parallel to the MW axis going through log M (Min) and the LS 15 signal, from log M(Min) to the point where the LS signal is crossed again; and s is the slope between the two peaks of the GPC curve, defined at log M of 5.1 and 6, wherein the GPC curve is defined as the concentration normalized LS 15 signal along the molecular weight of conventional GPC, obtained from the GPC-VISC-LS analysis, a multi-layer structure such as a coated metal pipe, comprising one layer comprising said polymer composition and the use of said polymer composition as adhesive polymer composition and for the production of a multi-layer structure.

ADHESIVE COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED METAL MEMBER, AND METHOD FOR PRODUCING METAL-RESIN COMPOSITE BODY
20220073793 · 2022-03-10 ·

An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER

A composition contains an inorganic nitride, and a compound represented by General

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Multilayer adhesive article

An adhesive article is described comprising a foamed adhesive layer and a non-foamed adhesive layer. The adhesive of each adhesive layer comprises a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and optionally a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications and is designed to fail cohesively.

Adhesive film for printed wiring board

An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

Adhesive Film for Printed Wiring Board
20210212197 · 2021-07-08 ·

An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.

Composite Coatings Having Improved UV and Paint Stripping Resistivity and Methods for Making Same

A composite structure having a co-curable or co-cured coated epoxy-based composite material coated with a co-curable epoxy-based adhesive surfacing material layer and a polyurethane-based coating material layer, along with components and large objects including the co-curable or co-cured coated epoxy-based composite structures.

Urethane acrylate hybrid structure adhesives
10844254 · 2020-11-24 · ·

A polymerizable adhesive composition comprising a two-part hybrid polymerizable adhesive composition is disclosed. In particular, the polymerizable adhesive composition comprises an organoborane monoamine complex, a free polyol comprising a dimer fatty polyol and a polyether polyol, at least one free radically polymerizable component, an isocyanate-terminated urethane pre-polymer, a free isocyanate and a low molecular weight chain extending compound. Also disclosed is methods of making and using a hybrid adhesive obtained from polymerization of the polymerizable adhesive composition.

SURFACE TREATMENT TO ENHANCE BONDING OF COMPOSITE MATERIALS
20200198313 · 2020-06-25 ·

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer containing blocked isocyanate compounds is applied onto a curable composite substrate, followed by co-curing. The surface treatment layer may be a resin layer without fibers or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.