A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

Disclosed are hot-melt, curl-free methods, structures, and compositions. One embodiment provides an optionally oriented base film having a first side and a second side, wherein the optionally oriented base film base film is transparent or opaque. Further, the composition includes a water-based primer applied to the first side. Further still, the composition includes a water-based coating applied to the first side having the water-based primer disposed thereon, wherein the water-based coating has a weight of at least 0.1 g/m.sup.2, wherein the composition is curl-free and has a barrier to one or more migratory additives and components in a hot-melt adhesive on the first side.

A polymerizable adhesive composition comprising a two-part hybrid polymerizable adhesive composition is disclosed. In particular, the polymerizable adhesive composition comprises an organoborane monoamine complex, a free polyol comprising a dimer fatty polyol and a polyether polyol, at least one free radically polymerizable component, an isocyanate-terminated urethane pre-polymer, a free isocyanate and a low molecular weight chain extending compound. Also disclosed is methods of making and using a hybrid adhesive obtained from polymerization of the polymerizable adhesive composition

A composite structure having a co-curable or co-cured coated epoxy-based composite material coated with a co-curable epoxy-based adhesive surfacing material layer and a polyurethane-based coating material layer, along with components and large objects including the co-curable or co-cured coated epoxy-based composite structures.

A multi-layer composition to be located onto a substrate. The composition comprises a bi-layer construction, including a first layer and a second layer, the first layer having a high elastic modulus and tensile strength in comparison to the second layer. The second layer includes a blowing agent such that, when cured, the first layer is spaced away from the substrate. The compositions of the first layer and second layer are similar, thus enabling the reconstitution of scrap into usable material for forming another multi-layer reinforcement.

A protection membrane-forming film (1) containing a filler, wherein the average particle size of the filler is not more than 0.4 m, a protection membrane-forming sheet (2), a production method and an inspection method for a workpiece or a processed product which use the film and the sheet, and a workpiece and a processed product determined as adequate products by the inspection method. The protection membrane-forming film and the protection membrane-forming sheet of the invention enable the formation of a protection membrane having excellent print legibility when subjected to print processing by laser irradiation.

A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.

The present disclosure is drawn to an adhesive printable film. The film can include a polymeric film substrate, an image receiving layer, and an adhesive layer. The polymeric film substrate can have a first side and a second side, and can be transparent or translucent. The image receiving layer can be applied on the first side and can include a crosslinked polymeric network and polymeric particles dispersed therein. The peelable adhesive layer can be applied on the second side and can include a continuous matrix polymer having adhesive particles and plastic particles dispersed therein.

An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.

The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.