The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

A method for sealing a substrate having one or a number of electrically conductive surface regions, including the (i) arranging of a sealing membrane, having a plastic layer and an outer adhesive layer made of a melt adhesive, on the substrate, wherein the adhesive layer is facing towards the substrate, (ii) the positioning of an induction heating device over the sealing membrane, and (iii) heating the melt adhesive for the fusion or partial melting thereof by means of the inductive heating of the electrically conductive surface regions with the induction heating device, in order to adhere the sealing membrane to the substrate after cooling. The method facilitates the sealing of substrates with sealing membranes. Same is suitable, in particular, for sealing floors or ceilings or parts thereof.

Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer, with which it is possible to obtain an interlayer insulating layer having exceptional adhesion to a circuit board even after accelerated environmental testing, and exceptional heat resistance, dielectric characteristics, and low thermal expansion. Specifically: an interlayer insulating resin film containing an epoxy resin (A), a cyanate resin (B), and a dicyandiamide (C); an interlayer insulating resin film having an adhesive auxiliary layer, the adhesive auxiliary layer being provided on one surface of the above-mentioned interlayer insulating resin film, wherein the adhesive auxiliary layer having an adhesive auxiliary layer contains an epoxy resin (a), a cyanate resin (b), and an inorganic filer (c); and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin film having an adhesive auxiliary layer.

Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.

A display device in one example includes a display panel, a supporting frame supporting the display panel, and an adhesive between the display panel and the supporting frame. The supporting frame includes a case, and a thermal shape changing part constituting a portion of the case. The thermal shape changing part includes a shape memory material.

Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.

Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.

An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.

A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.