The present invention relates to a hyaluronic acid-based dissolving film, a production method thereof, and a release liner used for the same, and more particularly to a method for producing a hyaluronic acid-based dissolving film that provides a hyaluronic acid-based dissolving film having high performance with high productivity through a continuous production process to allow mass production of the dissolving film, a hyaluronic acid-based dissolving film produced by the method, and a release liner suitable for the dissolving film.

An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

An objective is to provide a method for judging the authenticity of a product or component. Provided is a method for judging product or component authenticity. The method includes a step of determining the percentage of radioactive carbon-14 based on ASTM 6866 with respect to at least one constituent that a product or component of interest obtained has. Here, at least one constituent that an authentic product or component has and that corresponds to the constituent of the product or component of interest includes a resin comprising a prescribed percentage of radioactive carbon-14.

One of the purposes of the present invention is to provide a composite heat-release sheet which is excellent in thermal conductivity and electrical insulation property and, at the same time, has all of sufficient adhesion to an actual machine, low thermal resistance, reworkability, and reliable adhesive strength. Another purpose is to provide a more convenient production process for the heat-release sheet. A thermally conductive silicone rubber sheet comprising at least one thermally conductive silicone rubber layer having a type A durometer hardness of 60 to 96 and at least one silicone adhesive layer, wherein the silicone adhesive layer is a cured product of an addition curable or peroxide curable silicone adhesive composition comprising (a) organopolysiloxane having at least one alkenyl group bonded to a silicon atom and having a phenyl group bonded to a silicon atom in such an amount that the percentage of the number of the phenyl group is 2 to 20%, based on the total number of substituents each bonded to a silicon atom, (c) thermally conductive filler having an average particle diameter of less than 10 μm and containing 0 to 3 mass % of particles having a particle diameter of 20 μm or more and 0 to 0.01 mass % of particles having a particle diameter of 40 μm or more, and (f) silicone resin comprising an R.sub.3SiO.sub.1/2 unit and an SiO.sub.4/2 unit.

A roll and a method for producing a roll which are capable of effectively preventing tunneling are provided. A roll includes a core having a tubular shape and a laminate wound around the core. The laminate includes a process film, a surface coat layer, a substrate layer, an adhesive layer, and a release liner, in this order, in a laminating direction. The process film is formed from at least one member selected from polyethylene terephthalate (PET), polyolefins, and polyvinyl chloride (PVC). The surface coat layer is formed from a fluorine resin. The release liner is formed from polyethylene terephthalate (PET). The core is formed from an acrylonitrile-butadiene-styrene copolymer resin (ABS) or polypropylene (PP).

Provided are an adhesive film and an optical member comprising same, the adhesive film comprising at least two types of (meth)acrylic monomers for a (meth)acrylic prepolymer, and (meth)acrylate containing silicon, wherein the release force of the adhesive film with respect to a polyimide film is approximately 0.5 gf/in to 5 gf/in.

The present disclosure relates to the technical field of film sticking, more particularly to a sticking film, a film-sticking tool and a film-sticking assembly. The sticking film includes a tempered film for attaching to the screen of an electronic product, and a release film layer attached to the tempered film. The release film layer is an electrostatic layer, the release film layer and the tempered film are separated when pasting, and the side of the release film layer that is attached to the tempered film generates static electricity to attract dust on the screen. Thus, static electricity can be generated when the release film layer and the tempered film are separated, which can attract dust on the screen of electronic products and clean the screen, and avoids dust particles from scratching the screen due to direct wiping of the screen, resulting in damage to the performance of the screen.

The purpose of the present invention is to provide a storage state in which a reactive compound layer can be stably maintained in a polymer film having a reactive compound layer on the surface. The film roll is obtained by winding together: a first polymer film having a reactive compound layer on the surface, and a second polymer film having a surface roughness (Ra) of 0.1 μm or more and a modulus of elasticity of 300 MPa or more and 10 GPa or less. The film bundle is obtained by laminating the first and second polymer films. Preferably, storing the film roll and the film bundle at a low temperature enables a thin layer of a reactive compound to be stably maintained.

A method for manufacturing a semiconductor device, the method including irradiating a laminated body for temporary fixing with light and thereby separating the semiconductor member from a resin layer for temporary fixing. The laminated body for temporary fixing is formed by a method including: laminating a film material for temporary fixing on a light-absorbing layer in a direction in which a first principal surface is in contact with the light-absorbing layer; and peeling off a second release film from the film material for temporary fixing to expose a second principal surface. When the maximum values of logarithmic decrements of the first principal surface and the second principal surface of the resin layer for temporary fixing in rigid pendulum measurement are designated as δ.sub.max1 and δ.sub.max2, respectively, δ.sub.max2 is smaller than δ.sub.max1.

Film constructions and articles including the film constructions, wherein a film construction includes: a backing (or an adhesive layer) having a first major surface and a second major surface; and a release layer disposed on the first major surface of the backing (or adhesive layer), wherein the release layer includes polylactic acid.