Disclosed is an adhesive system and method of use thereof wherein the adhesive composition comprises a moisture curable adhesive comprised of an isocyanate terminated prepolymer and a cure accelerator having two curatives components having different cure kinetics. The cure accelerator is comprised of an isocyanate reactive compound comprising a primary, secondary or tertiary amino group, or a primary thiol group having faster curing kinetics resulting an increase in bead stability within the first minutes and a polyol selected from a diol and/or triol with slower curing kinetics allowing for sufficient open time and yet a fast strength build up. The preferred method of application of the adhesive system is via a 1K application gun.

A silicone pressure sensitive adhesive composition containing: (A) a polydiorganosiloxane gum having a number average molecular weight≥500,000 g/mol, where the polydiorganosiloxane gum is terminated with an aliphatically unsaturated group; (B) a polydiorganosiloxane polymer having a number average molecular weight≤100,000 g/mol and an aliphatically unsaturated group content of >0.13 weight %; where starting materials (A) and (B) are present in a weight ratio (B)/(A) of 0.4 to 1.6; (C) a polyorganosilicate resin having a number average molecular weight<4,000 g/mol, where starting materials (A), (B) and (C) are present in a weight ratio (C)/(B+A) of 1.4 to 2; (D) a polyorganohydrogensiloxane; where starting materials (A), (B), and (D) are present in amounts sufficient to provide a molar ratio of silicon bonded hydrogen atoms/silicon bonded aliphatically unsaturated groups (SiH/Vi ratio) of 4 to 30 in the composition; (E) a hydrosilylation reaction catalyst; (F) an anchorage additive; and (G) a solvent. It is suitable for use in protective films for ultrasonic fingerprint sensors in display devices.

An adhesive film or the like which is a laminate containing a substrate film containing a polycarbonate, a primer layer laminated on the surface of the substrate film, and an adhesive layer laminated on the surface of the primer layer opposite the substrate film.

There is provided a conductive adhesive which can suppress erosion of polycarbonate and form a cured product exhibiting excellent conductivity at a low temperature. There is also provided a conductive adhesive which can form a cured product exhibiting excellent adhesive property to plastics (particularly carbonate) at a low temperature. The conductive adhesive according to the present invention is a conductive adhesive which contains the following components (A) to (C) and is liquid at 25° C.: component (A): an alicyclic epoxy resin; component (B): a boron-based thermal cationic initiator; and component (C): a conductive filler.

A moisture curable hot melt adhesive composition that includes isocyanate-terminated polyurethane prepolymer that includes the reaction product of a crystalline polyester polyol, a polyether polyol, and diisocyanate, clay, polyester/polyether elastomer, a first thermoplastic polymer selected from the group consisting of ethylene vinyl acetate copolymer, ethylene (alkyl)acrylate copolymer, and combinations thereof, a tackifying agent, and optionally a second thermoplastic polymer selected from the group consisting of thermoplastic polyurethane, thermoplastic polycaprolactone, and combinations thereof.

A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.

There is provided curable silicone elastomer compositions having enhanced adhesive properties with respect to a wide variety of substrates. The curable silicone elastomer compositions described herein are provided with a phenylmethylpolysiloxane based additive which comprises at least one, alternatively at least two Si-H groups per molecule and at least one, alternatively at least two anhydride functional groups per molecule. Said phenylmethylpolysiloxane based additives provide resulting elastomers with improved heat-humidity stabilization.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.

The disclosed thermally bondable adhesive tape backing has a pressure-sensitive adhesive at a surface and a thermoplastic polyurethane adhesive at an opposite surface for thermal bonding to a device. The thermoplastic polyurethane adhesive softens and melts at a relatively low temperature. Therefore, melting of thermoplastic polyurethane adhesive is achieved while the pressure-sensitive adhesive remains in place and is not pressed away at the region of the thermal bonding.

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.