An adhesive laminate comprising (A) a light-transmitting substrate layer formed from a melt extruded thermoplastic resin, (B) a hard coat layer formed by using a hard coating agent comprising not less than 13 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the layer B excluding a solvent, (C) an adhesive primer layer, and (D) an elastic adhesive layer. Layers (A)-(D) are formed in this order. Layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 m and an indentation elasticity modulus of 500 to 4,000 MPa. Layer D has a thickness (Y) of 0.9 to 14 mm.

The present invention provides a vacuum thermoforming adhesive composition containing a polyurethane polymer and an acrylic polymer and having a difference in melting temperature and cross-linking temperature of 30-60 C. In addition, provided is a vacuum thermoforming decoration sheet comprising: an adhesive layer, a substrate layer formed on the adhesive layer; a printing layer formed on the substrate layer, and a transparent substrate layer formed on the printing layer, wherein the adhesive layer is formed from the defroster vacuum thermoforming adhesive composition.

A thermo-reversible adhesive composition containing a base resin, methyl acetoacetate, and a metal-organic complex compound having the formula M(X).sub.n(R).sub.o, wherein: M is a metal selected from the group consisting of aluminum, iron, and nickel, X is acetylacetonate, R is H.sub.2O, n is an integer equal to 2 or 3, and o is an integer greater than or equal to 0 and less than or equal to 2, such that n+o is equal to 3 or 4.

A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating. A weight reduction rate W.sub.0(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10 C./min from 23 C. to 400 C. with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 232 C. and a humidity of 5020%, and a weight reduction rate W.sub.24(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10 C./min from 23 C. to 400 C. with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 232 C. and a humidity of 5020% for 24 hours, satisfy 1%W.sub.0W.sub.240.5%.

Semi-crystalline polyester polyols and their use in reactive hot-melt adhesives are disclosed. The polyols comprise recurring units of a C.sub.2-C.sub.10 aliphatic diol, a C.sub.8-C.sub.24 aliphatic dicarboxylic acid, and 1 to 20 wt. % of an aromatic dicarboxylic acid source, a polycarbonate, or a combination thereof. The polyols have a hydroxyl number within the range of 14 to 112 mg KOH/g. Reactive hot-melt adhesives from the polyols and composite structures produced using the adhesives are also disclosed. A minor proportion of aromatic dicarboxylic acid, polycarbonate content in the polyester polyol surprisingly improves the properties of reactive hot-melt adhesives when compared with a commercial hot-melt adhesive or an adhesive formulated using an all-aliphatic polyester polyol. The adhesives are useful for bonding a wide variety of substrates, including paper, wood, glass, ceramics, plastics, and metals.

Ionizing radiation crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers and having an acid content of no more than 3% by weight. The precursors can be exposed to a source of ionizing radiation, for example, one or both of an electron beam or gamma radiation, for an exposure time sufficient to receive an energy dose sufficient to at least partially crosslink the adhesive precursor, thereby forming a pressure sensitive adhesive. Methods of using ionizing radiation to crosslink a crosslinkable pressure sensitive adhesive precursor are also disclosed.

A two-component polyurethane composition containing at least 55% by weight of polybutadiene polyols based on the total amount of all polyols having an average molecular weight of at least 500 g/mol, and at least one latent hardener, where the ratio of the number of reactive groups in the latent hardener to the number of OH groups present is in the range from 0.02 to 0.4. The composition has a long open time, blister-free curing, a very low glass transition temperature, high elasticity and surprisingly high strength which is very constant over a wide temperature range. Furthermore, it has very good adhesion to metallic and nonmetallic substrates, causing barely any stress cracks on glassy thermoplastics.

The present invention provides a transparent electroconductive layer-equipped cover element having a pressure-sensitive adhesive sheet preliminarily laminated thereto, wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer in which a refractive index adjustment zone having a refractive index greater than that of a base pressure-sensitive adhesive material thereof is formed over a given range from a surface of the pressure-sensitive adhesive layer in a thickness direction thereof, whereby: in a lamination process of a customer which is a supply destination of the transparent electroconductive layer-equipped cover element, it becomes possible to eliminate a need to distinguish between obverse and reverse sides of the pressure-sensitive adhesive sheet itself; and, when the transparent electroconductive layer-equipped cover element is bonded to an optical element through the pressure-sensitive adhesive layer, it becomes possible to suppress internal reflection in a laminate formed of these optical elements.

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.

A method for producing an optical silicone assembly is disclosed. The method comprises the steps of: i) treating a surface of a substrate with an optically clear silicone adhesive composition; ii) placing the substrate obtained by step i) into a mold; iii-a) injecting an optically clear moldable silicone composition into the mold, and/or iii-b) overmolding the optically clear moldable silicone composition onto the substrate; and then iv) heating the optically clear moldable silicone composition to form the optical silicone assembly. The optical silicone assembly produced by the method of this disclosure is characterized by excellent adhesion of an optical silicone product to various types of substrates.