[Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [] of 0.01 or more but less than 0.50 dl/g measured at 135 C. in a decalin solvent.

[Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [] of 0.01 or more but less than 0.50 dl/g measured at 135 C. in a decalin solvent.

An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y, each of the subunits Y and Y having a high glass transition temperature of from 70 C. to 130 C. with a low glass transition temperature subunit Z having a low glass transition temperature of from 100 C. to 10 C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70 C., the adhesive is amenable to being removed, repaired, or reworked.

A thermo-reversible adhesive composition containing a base resin, methyl acetoacetate, and a metal-organic complex compound having the formula M(X).sub.n(R).sub.o, wherein: M is a metal selected from the group consisting of aluminum, iron, and nickel, X is acetylacetonate, R is H.sub.2O, n is an integer equal to 2 or 3, and o is an integer greater than or equal to 0 and less than or equal to 2, such that n+o is equal to 3 or 4.

Semi-crystalline polyester polyols and their use in reactive hot-melt adhesives are disclosed. The polyols comprise recurring units of a C.sub.2-C.sub.10 aliphatic diol, a C.sub.8-C.sub.24 aliphatic dicarboxylic acid, and 1 to 20 wt. % of an aromatic dicarboxylic acid source, a polycarbonate, or a combination thereof. The polyols have a hydroxyl number within the range of 14 to 112 mg KOH/g. Reactive hot-melt adhesives from the polyols and composite structures produced using the adhesives are also disclosed. A minor proportion of aromatic dicarboxylic acid, polycarbonate content in the polyester polyol surprisingly improves the properties of reactive hot-melt adhesives when compared with a commercial hot-melt adhesive or an adhesive formulated using an all-aliphatic polyester polyol. The adhesives are useful for bonding a wide variety of substrates, including paper, wood, glass, ceramics, plastics, and metals.

A pressure sensitive adhesive composition and a protective film employing the same are provided. The pressure sensitive adhesive composition includes 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer includes at least one block copolymer. The block copolymer includes a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets one of the following conditions: (1) the content of the vinyl aromatic monomer is from 15 wt % to 25 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt % or, (2) the content of the vinyl aromatic monomer is from 10 wt % to 15 wt % and the content of the vinyl group of the conjugated diene block is less than or equal to 45 wt %, or greater than or equal to 60 wt %.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

There is provided curable silicone elastomer compositions having enhanced adhesive properties with respect to a wide variety of substrates. The curable silicone elastomer compositions described herein are provided with a phenylmethylpolysiloxane based additive which comprises at least one, alternatively at least two SiH groups per molecule and at least one, alternatively at least two anhydride functional groups per molecule. Said phenylmethylpolysiloxane based additives provide resulting elastomers with improved heat-humidity stabilization.

Provided is a photochromic film laminate including (a) a first polymeric film layer having a first surface and an opposing second surface; and (b) an adhesive layer over at least a portion of and in direct contact with the first surface of the first polymeric film layer (a). The adhesive layer is formed from a composition of a thermoplastic polyol having a number average molecular weight greater than or equal to 30,000 g/mol; a poly(anhydride); and a photochromic material. The thermoplastic polyol (i) is present in the composition in an amount greater than or equal to 60 percent by weight based on total combined weight of solids present in the thermoplastic polyol (i) and the poly(anhydride) (ii). Also provided is an optical article prepared with the photochromic film laminate.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.