A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

A lubricant material for assisting machining process comprising fullerene.

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive.

A bonding composition joins polymer components by material engagement. The bonding composition includes a solvent and a polymer material, which may be made from similar polymers from which the polymer components are made. There may be a kit for producing a polymer components and a bonding composition. The polymer production includes volatilization of the solvent and optionally melting the polymer materials.

A water activated tape and method of producing is provided, the tape comprising a repulpable material, a water-soluble material affixed to the repulpable material, and a water activated adhesive layer affixed to the water-soluble material.

There is provided a self-sealing article comprising a polymeric layer disposed on and covering a first major surface of an elastic porous layer, wherein the article passes Modified Test 1 of ASTM D-1970/D-1970M-13 or Modified Test 2 of ASTM D-1970/D-1970M-13, or Modified Test 3 of ASTM D-1970/D-1970M-13, and further wherein the self-sealing article is water vapor permeable and an air and water barrier. There is also provided a linered version of the self-sealing article in which a liner is disposed on a major surface of the polymeric layer opposite the first major surface of the elastic porous layer.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

Provided are articles, along with related methods, capable of providing an effective adhesive bond to a substrate containing polyetherketoneketone. The multilayered article includes a substrate comprising polyetherketoneketone, an adhesion promoter disposed on the substrate, the adhesion promoter comprising at least one of organotitanate, polyamide, surface-treated nanosilica, ammosilane or epoxy silane, and an adhesive bonded to the adhesion promoter. The adhesive contains at least one of an acrylic polymer, a polysulfide, a polythioether, an epoxy resin, or a silicone resin.